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Increased functional density with shrinking technology could result in escalating noise-induced failures in the field. Further, the low correlation between system level functional test and production test is making it difficult to better screen parts that would fail in the field due to noise. To address these issues, in this paper we present a light-weight fully digital on-chip distributed sensor...
Circuit boards are especially vulnerable to security attacks. Many routes and pins can be probed directly. Other pins may be controlled and observed through the JTAG boundary scan port. The JTAG port may also provide access to each chip's internal scan chains. Furthermore, modern chips may include embedded instruments that can be accessed through the chip's JTAG port and an internal IEEE P1687 scan...
A large end-to-end database was created by joining an IC test factory database with a board contract manufacturer (CM) database using the unique electrical identity fused into the IC and read at IC and CM test steps. A new rank correlation method was used to measure statistical dependencies of IC failure rates in the CM factory on failure rates and attributes measured in the IC factory. IC factory...
With shrinking geometries of PCBs, increasing interface speeds and corresponding loss of test point access to diagnose structural test defects, new standard test mechanisms are needed to test chip-to-chip connectivity and functionality at the board level. New requirements for an integrated circuit ‘BA’ (Board-Assist) BIST to structurally test these interfaces will be presented. A standardized BA-BIST...
Testpoint erosion, the continuously increasing loss of physical net/node access at the In-Circuit Test process step is putting board test strategies at risk [1]. In response, the International Electronics Manufacturing Industry (iNEMI) [2] 2009 road map and gap analysis [3] efforts launched a Technology Integration Group (TIG) ‘Built-in Self-Test Project’ or ‘BIST projecty’ [4] to drive a new test...
With the erosion of printed circuit board test points, a shift to high density interconnect (HDI) and continuing requirements that involve signal integrity verification of high-speed routes, board test is becoming much more complex. Assistance from embedded instruments in the ICs at board level test and multi-vendor embedded instrument access and solutions are becoming critical. In particular, to...
Product cost and revenue trends are not consistent with the cost of Test, Inspection and Measurement (TIM) technologies. Specifically, while Moore?s Law has applied to the silicon in the product, it does not apply to the overall cost of test of the resulting higher-functionality, desirably lower-cost product. Higher performance and lower cost test equipment, while also desirable, are not enough to...
With board and component technology and integration rapidly increasing and becoming more complex, the testing of boards standalone and in a system is becoming more difficult, time consuming and costly. This paper addresses integrated circuit (IC) Built In Self Test (BIST) usage at the board and system test levels to provide increased test coverage, reduced test time and cost. This paper presents the...
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