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Copper wire bonding is becoming popular on multi chip (MCM) device in parallel with the general industry trend of integrating more functions into single product. In order to support device to device interconnect; bond stitch on ball (BSOB) bonding method is quite generally used in the industry. However, copper wire due to its material hardness is more difficult to be manufactured into BSOB as compared...
The reliability-limiting effects in 3D IC structures using TSVs including mechanical stress distributions and the resulting effects on material integrity (e.g. failure modes like interface delamination, cohesive cracking, metallurgical degradation at joints, and chip-package interaction) and finally on device performance degradation are challenges in advanced 3D integration technologies and product...
In this study, miniature solder joint behaviors of Sn3.8Ag0.7Cu (SAC387) solder were tested and discussed for a range of geometrical ratios and strain rates at room temperature. Copper-solder-copper rod specimens were machined and soldered with SAC387 based on their specified geometrical ratio and then tested with an uni-axial load at a constant strain rate of 0.01s−1. Orowan's approximation equation...
Materials used in the electronic packaging industry are generally categorizes as Direct and Indirect materials. Direct materials would constitute items like substrates, underfill, thermal lids, fluxes, solder materials. On the other hand, indirect materials category would include items such as metal carriers, plastic injection molded trays used to transport the electronic components during across...
The need to track every lot before and after each process or step into the system is an unavoidable task as this is how the lot is tracked for its location, timeliness and status. In general, the data entry to the system or paperwork may consist of multiple steps and sequence, this would definately contribute and occupy precious production time. This calls for an automated lot transaction system to...
European power module manufacturers pioneered the development of a silver sintering technology, called low-temperature joining technology (LTJT) for lead-free chip attach. Sintered chips on substrate are shown to have better performance and significantly higher reliability at chip junction temperature over 175°C. However, the European process is complex requiring pressure of 20 to 40 MPa to lower...
Debugging hardware (ex. Device-Interface-Board or DIB) is very difficult especially if it is not your hardware design or set-up problems during production. ATE has their own checker to identify the problem of the instruments cards. Is your own designed test hardware or production released hardware has its own checker?
Plasma cleaning has been employed to increase the yield and reliability of gold wire bonding for many years in the IC packaging industry. However with the rising cost of gold, increasing numbers of manufacturers are transitioning to copper wire for the economic benefits. Bonding with copper wire is not without challenges; special equipment and different process parameters are required as copper wire...
Today the device that required intensive RF testing in mass production is commonly performed using the expensive high end automated test equipment (ATE) installed with RF/microwave resources for measuring and analyzing the RF signals. We can reduce test cost if one could develop the RF test on the basic ATE without RF resources. The paper proposes a test method using the on board RF power detector...
In recent years, MEMs IC (Micro-Electro-Mechanical Systems) has gained its growth momentum in the growing smart phone and other consumer electronic market. In addition to consumer electronic market, MEMs IC also has its application in industrial, medical, environmental and other specific application. With the high volume, lower cost demand for MEMs IC for consumer electronics, MEMs packaging trend...
Doping lead-free solders with minor additions of alloying and impurity elements such as Ni, Bi or Zn appears to have major effects on the growth of intermetallics (IMC) in solder joints during reflow soldering between the Sn-Ag-Cu lead-free solders and the surface finish metallurgy. In this paper, the results of the effect of small Nickel additions (0.05 and 0.1 wt%) on intermetallic formation during...
This paper discusses a novel thermal management approach using nanostructured titania formed on high-aspect ratio micromachined titanium structures. A recently developed dry etching technology, with etch rates of more than 2 µm/min, enables bulk micromachining of titanium using an inductively coupled plasma to define high aspect ratio structures. This technology allows for the development of three-dimensional...
Often times IC test solutions are constrained by the capability of the choice or targeted tester technology in terms of parametric or functional test specifications. This choice or targeted tester technology is usually the main or majority tester platform that is being used in a given organization. This paper will focus on a methodology to extend the capability of a said tester for a higher precision...
The LED lighting market has grown rapidly in recent years. Silver (Ag) and silver-rich alloy wire are drawing more and more attention in the LED industry because of its better thermal and electrical conductivity, much lower price as well as higher reflectance rate. Being considered as a potential alternative to Au wire in LED packages, the bonding capability of Ag-alloy wire on a LED device was evaluated...
They are various type of automated test equipment (ATE) in the market targeted for testing different types of devices. For example, high voltage and high current ATE for power management devices. A mix signal ATE for devices required analog and digital testing with relatively lower power demand compared to power management devices. What if the device required high power and mix signal testing together?...
Cu oxides are widely used in various aspects of electronic applications such as superconductor, gas sensor, ferroelectricity and magnetism. In this paper we report a novel method for energy efficient and eco friendly synthesis of CuO nanocomposites with various physical structures and chemical nature. The nanocomposites were produced by pulsed wire explosion in deionized water at 1°C, 10°C, 15°C,...
Diebond process is one of the key assembly process step in terms of defining reliability and performance of an integrated circuit, IC product. The process requires epoxy dispense accuracy and consistency to ensure that IC is secured and within the required position in the lead frame pad ready for wire bonding. These requirements though in the realm of assembly manufacturing is easier said than done...
In this paper a system is introduced which makes 3D parts and patterns. These patterns are made up of metal droplets. The raw material is in the shape of wire. Molten droplets are generated in the droplet generator nozzle and deposit on a substrate having proper deposition rate, temperature and volume. By settlement of droplets on certain places beside and over each other in several layers, arbitrary...
The effects of the filler content and temperature on tensile properties of underfill were investigated using underfill materials which are composed of bisphenol F-type epoxy resin and spheroidal SiO2 filler. Young's modulus of underfill increased and fracture strain decreased with increasing the SiO2 filler content. The effects of the SiO2 filler content on Young's modulus and fracture strain were...
The effect of surface modification of Cu and solder foil by citric acid was investigated on the joint strength and the microstructure of the fluxless vacuum bonded Cu joint. In the joint with surface modification, the joint strength increases with increasing bonding temperature and time. The deviation of the joint strength in the joint with surface modification is very lower compared to that of the...
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