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The current paper deals with the application of thermal transient testing as a characterization tool for solar cells and modules. Based on the measurement of a representative samples -including concentrator and non-concentrator solar cells - we prove the applicability of this measurement technique. Metrics such as junction-to-base plate thermal resistance are derived and can serve as a basis of a...
The thermal management of semiconductor devices and systems has become a widely discussed topic over the past decades due to the ever increasing integration and the resulting power densities inside the packages. The increasing junction temperature is a great threat for the operation and the long-term reliability of the packaged device. One of the most important barriers in the heat conduction path...
The current paper deals with the application of thermal transient testing as a characterization tool for solar modules. Based on the measurement of a representative sample — a concentrator module — we prove the applicability of this measurement technique. Metrics such as junction-to-base plate thermal resistance are derived and can serve as a basis of a multi domain solar module model. The used technique...
In this paper an approach for the in-situ testing of cutting-edge thermal interface materials (TIM-s) is presented. The novel method is based on existing measurement standards and allows quick and repeatable thermal conductivity measurements on newly developed nano-composite based thermal greases in an application-like environment. During the development of the measurement system both the effect of...
In this paper a power cycling based in-situ reliability testing method is discussed for TIM materials. The material under test is put between the cooling surface of a TO-220 packaged semiconductor device and a cold-plate, like during normal operation while the whole assembly is fixed by a constant force. The heat is generated by powering the device in the package at the junction area. The generated...
In this paper a possible method demonstrated for in-situ reliability testing of various TIM materials. The method is based on thermal transient measurements of a power semiconductor device in a TO-type package which has a flat, external cooling surface. By powering the junction of the semiconductor cyclically the whole assembly is exposed to intense thermal cycles in which the main heat-flow path...
As the functionality of thermal simulators gets more and more complex, measurement techniques also improve. Thermal engineers face and increasingly difficult task to make the right selection from the existing tools. In this paper the applicability of the JEDEC JESD 51-1 static measurement method is compared to mainstream simulation tools especially MCAD or EDA embedded CFD solutions. Both techniques...
Both the modern environmental monitoring and the home automation applications require new tailor made humidity sensor solutions. A significant group of humidity sensors is based on the property changes of porous thick and thin films. Capacitive sensors make use of the dielectric property changes of such films upon water vapor uptake which depends on the surrounding media's relative humidity content...
The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture into the package may result in internal corrosion or shift of the operating parameters, the reliability testing of hermetically sealed packages has become a crucial...
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