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With new technology trends, arising through a confluence of factors such as Moore's law scaling and 3D integration, the role of thermal design is inexorably shifting from package-centric issues towards on-chip optimizations. This talk overviews the roots of this change, the circuit effects of elevated temperatures, and on-chip optimizations for effective thermal management.
The thermal design of huge systems, huge in terms of number of components not their size, enforces the usage of dedicated SW packages in which each component needs to be modeled adequately. Detailed 3D modeling is not possible at early design phases. An adequate compact thermal model (i.e. one with very few degrees of freedom) of each component should be used instead. It must be cast in a form that...
This paper physically and conceptually provides a general electrothermal network pi-model. Basing on the proposed network pi-model, an equivalent electrothermal circuit model (ETCM) and the associated thermal behavior analysis are also demonstrated for the SiOB with VCSELs in terms of characteristics of device materials and geometries. The introduced complicated structure of VCSELs constructed in...
This paper introduces an ongoing research on geothermal cooling solution (GCS) for outdoor cabinets that are used to contain telecom equipment such as FTTX network, mobile network and etc. The principle of GCS is that the heat generated inside cabinet from telecom facilities is transferred to water by an air-water heat exchanger, and then water dissipates the heat to shallow underground soil by water-soil...
This paper presents a new methodology called Flex-CTM for Flexible Compact Thermal Modeling to build and to interface compact thermal models at different modeling levels. Each part of an electronic system is prepared to be Bou ndary Condition independent (BCI) such as to be plugged to other parts. Each part model is reduced to save memory and time consuming at the simulation stage. The resulting pluggable...
A boundary-condition-independent (BCI) compact thermal model (CTM) was generated for an opto-electronic transceiver package called SFP (small form-factor pluggable device). The SFP has four internal power dissipating sources and the BCI CTM for the SFP was developed using the DELPHI methodology. This paper presents a detailed validation of the BCI CTM of the SFP in real-time applications using Flotherm,...
Due to the rapid growth in the number of transistors per chip, the power consumption of the average nMOS ASIC reached the level of one Watt, which is, in order of magnitude, about the maximum power consumption allowed for a cheap plastic package without thermal enhancements like drop-in heat spreader, fused leads or exposed pads. The internal chip temperature is the result of the combination of the...
Both computational and experimental methods play a key role in thermal characterization, particularly in prototyping and design with each having their own set of strengths and weakness. In this work the authors demonstrate that simulation methods can provide temperature information in three spatial dimensions and in critical regions that are inaccessible to measurement tools. Combining the complementary...
This paper presents a thermally actuated resonant microgyroscope fabricated using commercially available standard MEMS process MetalMUMPs. Chevron-shaped thermal actuator is being used to drive the proof mass whereas sensing mechanism of the proposed device is based on the parallel plate sensing electrodes. The proposed model consists of three proof masses coupled with each other to be driven in through...
3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. Key technologies for realizing 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnections. The complexity of these structures combined with reduced thermal spreading in the thinned dies complicate the...
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute multiple applications (games, video), while meeting additional design constraints (energy consumption, time-to-market, etc.). Moreover, the rise of temperature in the die for MPSoCs, especially for forthcoming 3D chips,...
3D integration architectures for microelectronic circuits have attracted much interest in the recent past, due to their capabilities for more efficient device integration and faster circuit operation. This type of assembly is formed by bonding multiple active layers through a dielectric material, and employs through-silicon vias for electrical interconnection. In this work we present the thermal analysis...
Nowadays the importance of solar cells and R&D in this field is steadily increasing. The most important parameter of a solar cell is the generated power, which can be enhanced by use of solar tracking. For a correct determination of the tracking system's efficiency an irradiation sensor is necessary, because the irradiation from the sun changes constantly. This sensor device is placed on the tracker's...
Gas sensor arrays based on metal oxides operating at high temperature are commonly used in many application fields. They can operate on different principles and each sensor may show very different responses to the individual gases in the environment. Data coming from the array can be merged for reliable gas detection. One point which is common to the different sensors types is that the atmosphere...
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