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The current paper deals with the application of thermal transient testing as a characterization tool for solar cells and modules. Based on the measurement of a representative samples -including concentrator and non-concentrator solar cells - we prove the applicability of this measurement technique. Metrics such as junction-to-base plate thermal resistance are derived and can serve as a basis of a...
The thermal management of semiconductor devices and systems has become a widely discussed topic over the past decades due to the ever increasing integration and the resulting power densities inside the packages. The increasing junction temperature is a great threat for the operation and the long-term reliability of the packaged device. One of the most important barriers in the heat conduction path...
In this paper an approach for the in-situ testing of cutting-edge thermal interface materials (TIM-s) is presented. The novel method is based on existing measurement standards and allows quick and repeatable thermal conductivity measurements on newly developed nano-composite based thermal greases in an application-like environment. During the development of the measurement system both the effect of...
In this paper a power cycling based in-situ reliability testing method is discussed for TIM materials. The material under test is put between the cooling surface of a TO-220 packaged semiconductor device and a cold-plate, like during normal operation while the whole assembly is fixed by a constant force. The heat is generated by powering the device in the package at the junction area. The generated...
In this paper a possible method demonstrated for in-situ reliability testing of various TIM materials. The method is based on thermal transient measurements of a power semiconductor device in a TO-type package which has a flat, external cooling surface. By powering the junction of the semiconductor cyclically the whole assembly is exposed to intense thermal cycles in which the main heat-flow path...
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