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Complex structures can be well modeled by simulation using appropriate field solvers; however the investigation of detailed models is a time demanding process even on the latest computers. This article surveys the new developments resulting in execution time reduction of the thermal and electro thermal field solver that takes a finite differences method (FDM) based model as input. This tool is based...
Increased operating temperatures of chips have aggravated leakage and reliability issues, both of which are adversely affected by high temperature. Due to thermal diffusion among IP-blocks and the interdependence of temperature and leakage power, we observe that the floorplan has an impact on both the temperatures and the leakage of the IP-blocks in a system on chip (SoC). An increase in temperature...
IR-thermography has become increasingly important for non-destructive testing of microelectronic devices and structures on chip, package and board-level. This paper focuses on the evaluation of best applicability for different pulse excitation modes to detect flaws and damages as well as to determine material properties. Pulse IR thermography using electrical and laser excitation was chosen as an...
Thermal characterisation of thermal interfaces becomes even tougher a challenge at low bond line thicknesses and higher thermal conductivities of the interface materials as more accurate measurement techniques are required. As in parallel the quest for high conductivity adhesives and greases is ongoing, a correlation between thermal bulk or interface properties and structure is in high demand. We...
The method of ldquoLogical Effort Delay Modelrdquo allows designers to quickly estimate delay time and optimize logic paths. But the previous variances of logical effort models do not mention how to handle process, voltage, and temperature (PVT) variations appropriately, which may induce a serious misestimate. According to simulation results, delay time increases 21% while temperature increasing from...
This paper reports comparative reliability of the hot carrier induced electrical performance degradation in power RF LDMOS transistors after novel methods for accelerated ageing tests under various conditions (electrical and/or thermal stress). It is important to understand the effects of the reliability degradation mechanisms on the S-parameters and in turn on static and dynamic parameters. The analysis...
Full-chip dynamic electro-thermal simulation is achieved by coupling a circuit simulator and a thermal solver. By letting both simulations run with their specific time-step, a higher computational efficiency is achieved. A scheduler synchronizes temperatures in the circuit simulator and dissipation patterns in the thermal solver on an dasiaas-necessarypsila basis. The 3D geometry for the thermal solver...
Computational fluid dynamics (CFD) for electronics cooling (EC) has developed differently from general-purpose CFD, due to the nature of the market it serves. The benefits are clear - the use of EC CFD in product design has had a profound impact on both time-to-market and cost.
Nowadays the demand for thermal standards for power LEDs is increasing. On the one hand metrics for fair comparison of competing products are needed, on the other hand, designers of power LED based applications demand reliable and meaningful data for their daily work. Todaypsilas data sheet information does hardly meet any of these requirements. Part I compares the current situation in the LED world...
The increasing need for standardisation of thermal characterisation of LEDS and LED-based products. Manufacturers and end-users alike are crying for fair and useful thermal data, but for different reasons. It goes without saying that the LED-business is growing exponentially, in fact, much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterisation has not...
An increasing demand for a higher heat flux removal capability within a smaller volume for high power electronics led us to focus on micro channels in contrast to the classical heat fin design. A micro channel can have various shapes to enhance heat transfer, but the shape that will lead to a higher heat flux removal with a moderate pumping power needs to be determined. The micro channel geometries...
This paper presents a method that considers thermal effects in logic simulations. The aim is to develop a tool that is capable of modeling the thermal behavior of a digital circuit and, at the same time, yields results almost at the speed of ordinary logic simulators. The importance of such a simulation is that thermal effects can be the cause of signal integrity problems. The structure and the basic...
In our project the final goal is to develop the cost-effective roll-to-roll technology of fabricating large area, high throughput OLED devices for intelligent lighting applications. The main achievements of the first six months of the project are described in this paper. An electro-thermal FDM simulator was developed on the basis of an existing thermal-only simulator. The simulations proved the necessity...
Understanding of nanoscale energy transfer and transformations is of fundamental importance to a variety of technologies, such as chip packaging and energy conversion. Nanostructured materials provide scientists and engineers with many possibilities to manipulate energy transfer and its conversion into various forms. Currently, nanoscale management of energy-related transport and kinetics is mainly...
This contribution concerns an original solution concerning the integration of temperature and pressure sensors in a vapor chamber heat spreader for in-situ monitoring and optimization. The cooling systems integrated in the substrate of the electronic devices are providing a high robustness, offering a high heat conduction coefficient and the opportunity of local sensor integration using CMOS compatible...
Nowadays the quality of thermal interface materials (TIM) has a growing importance as the increasing dissipation level of ICs requires more and more sophisticated solutions to reduce the Rth along the heat-flow path. The recent approach of TIM manufacturers is to use nanoparticles as fillings in TIM materials, in order to enhance considerably the TIM thermal conductivity. On the other hand this solution...
We investigate theoretically the band structure of a phononic crystal of finite thickness constituted by a periodical array of cylindrical dots deposited on a thin plate of a homogeneous material. We show that this structure can display a low frequency gap, as compared to the acoustic wavelengths in the constituent materials. The opening of this gap requires an appropriate choice of the geometrical...
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