The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The following topics are dealt with: semiconductor thermal measurement; multidisciplinary thermal management; liquid cooling systems; thermal tools and calculators; embedded tutorial; data center; packaging advances; heat transfer fundamentals; microelectronics thermal characterization; heat sink geometries; high power density cooling; thermal process and design; materials science.
There is renewed interest in passive 2-phase immersion for cooling power electronics and high performance computers. This can be attributed to recent research showing its performance potential compared with more complex and costly techniques, to innovations that simplify its application and to a general trend toward higher power densities. Though the thermal performance capabilities of passive 2-phase...
This paper presents new investigations on the aging of Thermal Interface Materials (TIM) subjected to thermal cycling conditions. The challenge was to design a specific and original set-up in order to not only undergo avionic temperature mission profile (-50°C/150°C) but also to perform standardized thermal characterization at always same conditions. Thermal conductivity is used as aging indicator...
Microelectronic integrated circuits experience nonuniform high temperatures during normal operation. Thermal expansion mismatch among the different materials comprising the device lead to a large tensile stress after high temperature cycles. Voiding and open-circuit failure from cracking of interconnects are often observed during isothermal aging and thermal fatigue tests with or without electric...
The recent interest in air-side cooling and the spread of data centers into geographies with higher levels of atmospheric contamination is requiring more attention towards air quality management in data centers. One concern of air side economization is an increase in contamination levels potentially leading to more failures and outages of the IT equipment. In this paper we describe a corrosion measurement...
A novel thermal management technology was explored to lower the peak temperature associated with high power GaN transistors in pulse application. The technology involves the use of an embedded microscale PCM heat storage device within the chip (near the active channels of the GaN device), which effectively increases the heat capacity of the material by taking advantage of the latent heat of the PCM...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.