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The power system in package (SIP) includes multiple chips such as power IGBT, diodes and IC controllers. With more chips encapsulated in one single package, the silicon die crack failure is becoming more and more challenging. In this paper, a leadframe based power SIP package is investigated. The warpage induced reliability in assembly process is studied. The initial leadframe pad warpage will induce...
The power system in package (SIP) includes multiple chips such as power IGBT, diodes and IC controllers. With more chips encapsulated in one single package, the silicon die crack failure is becoming more and more challenging. In this paper, a leadframe based power SIP package is investigated. The warpage induced reliability in assembly process is studied. The initial leadframe pad warpage will induce...
In this paper, the impact of the lead frame design on the current carrying capability of the a power package is investigated. The coupled electrical-thermal and mechanical stress simulations are conducted, with the transient characteristics captured. The DoE simulations with regard to different lead frame design, different currents, and micro crack impact are studied to find the impact on current...
In this paper, an automotive power module (APM) package is considered with multiple die including MOSFETs, passive components, shunt resistor and thermistor attached on the direct bonded copper (DBC) substrate. 3D finite element models for design and assembly process are generated in order to conduct the DoE numerical simulations for each design and assembly process. In design phase, both electrical...
In this paper, the reliability performance of next generation WLCSP is studied through modeling. Intensive study is carried out from single bump design to package dimension design and the application design in PCB board. Polyimide, solder joint array layout with different width and length ratio and the PCB board via layout are simulated to improve the reliability performance. The models with different...
Comprehensive finite element analysis (FEA) modeling is carried out to improve the performance of critical designs of wafer level chip scale package (WLCSP). First, a design with one layer redistribution layout (RDL) copper with etched pocket in the non-covered UBM area and one layer polyimide structure (1Cu1Pi design) is investigated. Different polyimide layouts, copper thicknesses, pocket parameters...
Intensive FEA modeling was applied to the investigation of early solder joint failures of WLCSP mounted on test PCBs. In particular, stress in assembly reflow process was studied with 25 balls; 0.4 mm pitch WLCSP and PCBs with specially placed plated though vias. The 25 ball WLCSP in the study has 5×5 ball array, which corresponds to 16 outmost solder joints and nine inner solder joints, all soldered...
In this paper, a comprehensive modeling and test study is presented for the dynamic behaviors of WL-CSP subjected to JEDEC drop impact. A direct non-linear transient implicit dynamic method is introduced with the non-linear dynamic material properties that include solder, the aluminum metal stacking under the UBM and the PCB copper pad. The packages mounted on PCB and under PCB are checked and discussed...
In this paper, the impact from both mechanical and thermal effects, with different parameters on BPSG of a power package is studied. The impact parameters include wedge wire bonding force, clamping force from the spring clip, wave soldering process and power dissipation from the die. An advanced 3D FEA model framework with a global model and local sub-model is developed. Major modeling work includes...
In this paper, a methodology for wire bonding parameter modeling is developed, which considers the capillary, FAB and device on silicon. The impact of capillary profile and bonding process parameters which include ball diameter, bonding temperature and bond wire material properties are studied to optimize the wire bonding assembly process. Finally, the comparison of the results with and without the...
In this paper, an advanced 3D FEA model framework with global and local sub-model is developed to investigate the impact of the polyimide coating on passivation reliability. The modeling work consists of two parts: the first part is the transient thermal simulation under a power pulse. The second part is the thermal mechanical stress simulation with the transient temperature input from the first part...
In this paper, a transient non-linear dynamic finite element framework is built for the punch clamping process and a 3D bent lead frame geometry based on test data. The objective of this paper is to optimize the punch assembly process by modeling the complete punch clamping process through explicit finite element code LS-DYNA. Two major parts are considered: one is the lead frame bending geometry...
In this paper, a lead frame based system in package (SIP) for power management is examined. This package is built using multiple die types including power IGBTs, diodes, and IC controllers. To maximize product performance the power components use an ultra thin back grind. Thin dies minimize RDS(on), maximize thermal performance, and minimize the board standoff height by allowing the package to be...
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