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A series of lithographic metallization steps are used to build up the interconnect network on the chip during wafer fabrication and one often overlooked film technology that is an integral part of the process is the bottom anti-reflective coating (BARC), used to enable the production of uniform fine features in the resist. In order to create these features, near-perfect thin films must be produced,...
This paper investigated the correlation of activation energy between LED light source and LED luminaire in lumen depreciation test. Two nonlinear fitting methods were used to verify the stability of the different algorithms to extract the activation energy. The results show that the activation energy of LED luminaire is very close to the LED light source. Activation Energy is typically around 0.20eV...
The results of this work are contributions to the modeling and design a original microactuator system that allows braille reading. Here, we propose to use one matrix composed by six actuators to form the 63 Braille combinations. To define the geometry of the matrix we used the physiological limits of perception‥ In this work, we use a finite element model with the Comsol software for modelling this...
Nowadays electronic systems used in automotive industry consolidate a variety of functionalities and features within one unit. Such smart systems consist of standard IC packaging, sensors and actuators. It is required that such systems will survive about 15 years of usage. To assure correct functionality prognostic and health monitoring (PHM) methods can be used. The potential benefits from implementation...
This paper describes a method used for experimental real-time monitoring of thermo-mechanical stress build-up during integrated circuit encapsulation. To detect the stress variations during molding, special stress measuring chips were employed. The working principle of the stress chip is based on the piezoresistive sensors embedded on the surface in a 6 by 6 matrix distribution. [1]
Silicon carbide (SiC) semiconductor diodes are studied for high power and high temperature system applications. Our packaging technology is developing to ensure a working temperature above 300°C for Schottky and PIN diodes. This work presents an investigation on the thermal properties of proposed assembly of SiC die into a ceramic package. Ag micro particles and sintering process were used for the...
The tremendous development of tactile interface in many customers' applications such as Smartphone, tablet PC or touch pad leads industrials to study “haptic interfaces” or “touch screen” solutions. This technology is already used but with limitations such as high power consumption and limited feedback effect (simple vibration). PZT is a good candidate for many actuator applications due to its high...
In this study, Quad Flat No-lead (QFN) cavity package based on LCP and the reliability impact of the package geometry are investigated. A well-established model of Sn96.5Ag3Cu0.5 solder joint fatigue based on the Darveaux's methodology leading to strain energy density estimation is used. A dedicated Design of Experiments (DoE) is performed to assess the optimal thermo-mechanical properties of the...
We presented the numerical modeling of flexible actuator in the application of dynamic lighting. In order to analyze the Lorentz force exerted on the actuator, we first modeled the surrounding magnetic flux of the magnet. With appropriate layout design, the Lorentz force density distribution was then analyzed. The modeling provides us the overview of the Lorentz force density distribution, and thus...
Polysilicon is the most commonly used material for MEMS. Consequently, the Young's modulus of polysilicon is very important for MEMS design. Measurements of this material parameter can easily be erroneous due to fabrication tolerances, like etch loss variations. The presented method separates etch loss variations from the desired measurement by using an array of micro cantilevers. The measured Young's...
A new methodology and custom software tool is presented in this paper, which supports partial automation of designing and prototyping of electronic systems. The emphasis is put on component selection stage, which is realized in a substantially different way comparing to widely used parematric search engines. In presented approach besides of individual (component-level) parameters, also system-level...
Solid State Lighting (SSL) power converters are considered as the reliability bottleneck of a light emitting diode lighting system. This paper proposes a lifetime prediction method for solid state lighting power converter based on SPICE models and finite element thermal simulations. This method consists of four major parts: lifetime meter, components decay models, SPICE simulator and finite element...
Recently, consumer electronics demand has been geared towards lightweight, high efficiency, and small form factor devices. These characteristics can be accomplished by using three-dimensional (3D) integrated circuit (IC) technology. This study proposes a double-chip stacking structure in an embedded fan-out wafer level packaging (WLP) with double-sided interconnections. Regarding to the proposed structure,...
In this paper, a time-efficient 3D phase-field model, for simulating grain growth in Through Silicon Via (TSV) is presented. This model is modified to model grain growth in the cylindrical shape of a TSV to capture the effect of temperature in its microstructure. The data generated from this simulation is used to explain large distribution of Cu pumping (i.e. non reversible thermal expansion of TSV)...
In a high power module, a high electrical load may cause electromigration and induce the joule heating, subsequently raising the chip temperature. Temperature excursion in the IGBT chip may produce thermal stress, inducing failure in the metal wire and chip. Those failure modes degrade the reliability of a power module. This study elucidates the coupling behavior of a high power module through electro-thermal...
This paper presents an approach to dynamic thermal modeling of micromachined microbolometers. Firstly, all the important factors influencing temperature of infrared radiation sensing elements are identified in repeated numerical thermal simulations performed for a detailed device model, where temperature values were computed for time instants equidistantly spaced on the logarithmic time scale. Secondly,...
This paper investigates transient heat transfer between a heated spring probe and its air environment. A continuum finite volume simulation is used to analyze of heat flow within and from the resistively heated probe to its environment. Experimental results are conducted for spring probe with laminar air flow and without air flow. The numerical results and experimental results are compared and very...
Humidity test is common to all the packaged integrated circuits, few works have been reported on the study of the humidity effects combined with high temperature on packaged LEDs. Moreover, the packaged LEDs are also subjected to moisture environment in many of their applications. In this work, the high temperature-humidity (95°C-85% RH) aging test is used to evaluate the reliability of the packaged...
This paper presents investigations of thermo-mechanical stress generated due to the integration process of Surface Acoustic Wave (SAW) strain sensors. A 3D finite element (FE) model, based on visco-elastic material measurements, is developed for thermo-mechanical stress computation. The simulation results are compared with experiments. Therefore, SAW strain sensors were mounted, the sensor response...
The formation of a TSV for three-dimensional interconnects using SF6/O2 plasma is explored. Adjusting the O2 gas concentration to 45 sccm, while the SF6 concentration is set to 35 sccm, produced the best combination of chemical and physical etching to provide sidewall angles of 88°. Three TSV aspect ratios are etched (5/58, 10/100, and 20/100 µm) and subsequently analyzed using the finite element...
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