Search results for: Jiongxin Lu
Materials for Advanced Packaging > 459-502
IEEE Transactions on Dielectrics and Electrical Insulation > 2008 > 15 > 5 > 1322 - 1328
Journal of Electronic Materials > 2008 > 37 > 11 > 1691-1697
Journal of Electronic Materials > 2005 > 34 > 11 > 1432-1439