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This paper describes a systematic approach to map "black box" s-parameter behavior model into electrically meaningful RLC parameters based on physical layout and impedance transfer function theory. The s-parameter models are from either field solvers or from lab bench VNA measurement".
This paper covers the latest development of next generation I/O interface 3D power delivery modeling methodology to meet the challenging requirements of I/O interfaces. A method for I/O interface power delivery analysis covering package and system level has been developed by combining 3D field solver and Spice simulation. This paper focuses on how designing an optimized and economical power delivery...
The solid-state reaction between Ti-capped Er thin film and Ge(001) was investigated. The germanide film formed had a smooth morphology with the phase identified as ErGe1.5. The film is highly textured with ErGe1.5 (1100) //Ge(001). ErGe1.5 has a resistivity value ~18 muOmega.cm. The Ti cap was able to delay the erbium oxide formation to higher temperature.
The electronics industry trend is to offer products that are smaller, with more functionality, better performance and lower cost. Stacked chip scale packaging (CSP) is an innovative packaging technique that involves thinning silicon to enable multiple chips to be stacked in a package for integrated solution. Stacking memory chips and stacking memory and logic chips together are two typical approaches...
A simple approach for coating carbon nanotubes (CNTs) with silver nanoparticles was developed in this work, aiming to enhance the electrical conductivity of CNTs. To coat Ag nanoparticles on CNTs (Ag@CNTs) effectively, CNTs were treated using ball milling with addition of ammonium bicarbonate, followed by reduction of silver ions in N,N- dimethylformamide (DMF). Transmission electron microscope (TEM),...
In this paper, a numerical study based on the three-dimensional thermo-mechanical finite element method (FEM) has been conducted to analyze the reliability of SAW filter WLP. The 3D FEM model was firstly evaluated based on a benchmark analysis. The validated model is then applied to perform parametric studies on the effects of package geometry, material properties and the processing conditions on...
This paper introduces the principles and execution of a new technique for minute birefringence measurements based on simple polarimetry. The technique requires only three stepped photoelastic images although conventional phase-stepping methods require four images. To verify the new technique experimentally, a precise crystal wave plate of having 10.0+4.7 nanometers in retardation was used as a specimen...
Fiber attachment soldering is low cost and high-precision technology in direct-coupling optoelectronic packaging. The self-alignment of solder joint and the ultimate alignment accuracy depend on the parameters of design and manufacturing process, eventually the solder joint geometry. In this paper, the three-dimensional (3-D) geometry of solder joint in fiber attachment soldering was predicted by...
Miniaturized bandpass filters with high performance have become more and more important in today's wireless communication industry. Bandpass filters implemented with half-wavelength resonators have inherently harmonic frequencies at the multiples of frequency. A novel multistep transmission filter based on the strip-width modulation reformulation is proposed to suppress the spurious passband at the...
This paper explores the use of single-walled carbon nanotubes (SWCNTs) as a gas sensor for detecting organic gas molecules. A low-temperature dielectrophoresis (DEP) method is employed to combine CNTs with Transimpedance Amplifier (TIA) based on UMC 0.18 um 1P6M CMOS process into a nanosensor device.
Gold (Au) wire bonding to aluminum (Al) bond pad leads to the formation of intermetallic compounds and associated Kirkendall voids at high temperature exposures. The objective of this work is to investigate the impact of utilizing electroless nickel/ electroless palladium / immersion gold (Ni/Pd/Au) and electroless nickel / immersion gold (Ni/Au) plating on Au wire bondability and ball bond reliability...
A new leadframe design is proposed as a solution to eliminate package cracking in a HVQFN (heatsink very thin quad flat no lead) package. The impact of the new design was first analyzed using finite element modeling (FEM) particularly the interfacial stresses brought about by coefficient of thermal expansion (CTE) mismatches between materials. Result was further verified experimentally using thermo...
Considering two kinds of the most widely used wire bonding pads of the COB and BGA packaging styles, the characters of the bond interfaces in Al-Ni and Al-Au systems were compared after high temperature storage test through SEM observation. It was found that, according to the appearance, the Al-Au bond aged at 250degC in air for more than 40 days was expanded badly, and surface cracks were severe,...
This paper discusses signal integrity (SI) challenges in interfacing Intelreg 945 GMS graphics and memory controller hub (GMCH) with DDR2-533 memory (both SO-DIMM and on board memory for SFF (small form factor) designs. SFF designs are constrained by power and space. This paper outlines SI analysis through frequency domain (FD) methodology and correlates with time domain (TD) results. This paper could...
In order to actualize the fine pitch of wiring in FPC (Flexible Printed Circuit), the insulation degradation due to the migration becomes the problem, which cannot be ignored. Because of difference in its structure and wiring from the former printed circuit board, the analysis of migration behavior in FPC becomes important for evaluating the reliability of an electronic component based on FPC. In...
Miniaturized bandpass filters with sharp selectivity and low loss are required for wireless communication systems such as wireless local-area networks (WLAN). Since high permittivity dielectrics can reduce the size of bandpass filters, high dielectric constant ceramic materials are good candidates to prepare compact bandpass filters. In this work, a microstrip cross-coupled trisection bandpass filter...
Optimizing the elelctroplating condition, the thickness of a Pd layer in the Au/Pd/Ni/Cu pre-plated leadframe (PPF) is reduced to 8 -10 nm. Introducing a ~10 nm thick dense (Cu,Ni)3Sn intermetallic compound (IMC) layer in the PPF drastically reduces Cu out-diffusion and hence improves significantly the protection of the leadframes against oxidation and corrosion attack. The microstructural characterization...
Polymeric materials are used in several parts because their flexibility, low cost and excellent in processing. It is important to understand the some properties of polymeric materials for optimized design. The properties of polymeric materials are strongly influenced by meso-scale (10-9-10-3 m) structure such as entanglement, molecular weight distribution, and orientation, etc. But it is difficult...
The two critical parameters (film thickness and the refractive index) of waveguide structure are studied under different environmental condition, such as high temperature and high humidity to understand the reliability issues of the epoxy- based optical polymer. The thickness of the spin coated epoxy- based polymer film is decreased due to exposure at high temperature and increased due to exposure...
This paper reports the results of an investigation to create a thermal interface material (TIM) with adhesive functions. Previous tests with electro-spun nano fibrous polymer materials indicate high thermal conductivity of the films, and even higher thermal conductivity and lower resistivity had subsequently been obtained by adding thermally conductive nano particles. The thickness of the TIMs produced...
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