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In this paper, electrospray technology was utilized to fabricate micro membrane. The stable cone-jet injection mode was the key role to atomize uniformity particle and smooth membrane. As applied voltage ranged from 2.5kV to 7.5kV, the stable cone-jet model was built up. When the applied voltage increased from 2.5kV to 7.5kV, the average linear jet length increased from 3.699mm to 4.653mm under the...
This paper describes an easy-to-handle approach for creating three-dimensional millimeter-scale polymeric structures on various solid materials as a mold (soft lithography) using daily-use tools for developing in-vitro point-of-care diagnostics devices. These polymeric structures are made from UV-activated materials, adhesive tapes as the mask and UV-LED flashlight as the light source. This physical-based...
Organic/inorganic hybrid Schottky solar cells based on p-type conductive polymer poly(3,4-ethylenedioxythiophene): poly (sty renesulfonate) (PEDOT:PSS) in conjunction with n-type silicon substrates offer the merits of simple fabrication process and potential for lower cost. Here, we report an efficient organic/inorganic hybrid photovoltaic (PV) device based on silicon nanopillar arrays and PEDOT:PSS...
We demonstrate an ultralow-power, low-dispersion and compact silicon-organic-hybrid photonic crystal waveguide modulator. RF power consumption of 1.5nW, effective in-device r33 of 1190pm/V and Vπ×L of 0.291±0.006V×mm over 8nm optical bandwidth are demonstrated.
We demonstrate an integrated photonic electromagnetic field sensor based on an electrooptic polymer refilled slot photonic crystal waveguide modulator driven by a bowtie-antenna. The minimum detectable electric field is measured to be 2.5V/m at 8.4GHz.
A three-layer-stacked wafer with CMOS devices was fabricated for the first time by using hybrid wafer bonding and backside-via-last TSV (7-μm diameter/25-μm length) processes. Successful fabrication of this wafer confirmed that copper/polymer hybrid wafer bonding brings both seamless copper bonding and void-less underfilling in face-to-face (F2F) and back-to-face (B2F) configurations. The backside-via-last...
The development of the MEMS microphone has been an active area of research over the past several decades. MEMS microphones have advantages such as compact size, high signal-to-noise ratio, high sensitivity, quick response, and long term stability. MEMS microphone is also compatible with the surface mount process. There are various design considerations for MEMS microphone such as less interference,...
We realized the room temperature direct bonding method for polyethylene 2, 6 naphthalene dicarboxylate (polyethylene naphthalate, PEN) film by means of surface activated bonding method using nano-adhesion layer.
Dysplasia is a precancerous disease that tends to convert into carcinoma in-situ if not diagnosed and treated in time. A MEMS (Microelectromechanical System) based microgripper can mechanically diagnose the disease by measuring microscopic changes in cell size, nuclear to cytoplasmic ratio and cell membrane stiffness. The objective of this paper is to present novel MEMS based microgripper with integrated...
This paper presents an environment friendly fabrication technology of MEMS devices using biodegradable polymer material applying hot embossing and polishing process. The capability of the method was demonstrated through the fabrication and tested of a polylactic acid (PLA) thermal microactuator. The displacement was about 11 times larger than that of a Si counterpart. In this research, a monolithic...
The waste of valuable raw material due to kerf-loss during manufacturing of wafers is an important problem not only in photovoltaics but also in the semiconductor industry in general. Although a number of kerf-free wafering methods have been developed over the past decades they have not found significant use outside of the PV industry, due to some inherent shortcomings of those methods. Recently,...
Silicon/epoxy nanocomposites were synthesized in order to investigate potential improvement of electrical energy storage capability and mechanical properties of epoxy resin on addition of Si nanospheres. Nanospheres with mean diameter 130 nm were homogenized within epoxy monomers at 5 and 10 wt.%. The dielectric behavior of the resulting nanocomposites was investigated using broadband dielectric spectroscopy...
We demonstrate a novel method to define high Q silicon photonic crystal cavities with functional polymer cladding with ultra precision using spatially resolved electron beam bleaching of a chromophore doped polymer.
Incorporation of small particles in polymer increases resulting refraction index. Waveguides form such material may be effectively coupled with photoconductive antennas. Refraction index as well as scattering losses of Si nano and micro particles in polystyrene matrix are experimentally studied. Fibers and structured waveguides are suggested.
A concept is proposed and realized for post-fabrication trimming as well as new structures fabrication on functionalized silicon platform. Electron beam bleaching of a chromophore doped polymer cladding is applied.
3D packaging using through silicon via (TSV) technology is becoming important in the integrated circuit (IC) packaging industry. This paper reports the wetting behavior of polymer liquids in the insulation deposition process by spin coating. Two methods containing adding wetting agent into polymer liquid and coupling agent treatments to wafer surface were implemented to improve the wettability between...
In this investigation was used silicon-organic polymer containing thioacetamide group (-HN-C(S)-CH3-), which named poly[N-(3-silseskquioxanilpropyl) thioacetamide]-(PTAS-3). PTAS-3 was produced from silicon-organic monomer: 3-triethoxysilylpropylamine by hydrolytic poly-condensation reaction. Sorption of Pt (IV) ions from aqueous solutions of hydrochloric acid has been studied using the silicon-organic...
In recent years, "2.5D silicon interposers" and "Full 3D stacked" technology for high-performance LSI has attracted much attention since this technology can solve interconnection problems using TSV (Through Silicon Via) to electrically connect stacked LSI. 2.5D and 3D Si integration has great advantages over conventional 2D devices such as high packaging density, small wire length,...
In this paper, we both theoretically and experimentally demonstrate that 90 % lower optical loss is realized with multimode crossed polymer optical waveguides by introducing graded-index (GI) cores, compared to conventional step-index (SI) core counterparts. First, the light leakage losses of crossed waveguides with SI and GI cores are simulated using a ray-trace simulation. Then, we show that a drastic...
This paper presents a reliability study on a 15×15mm2 silicon interposer packages, 5 times larger surface than usual studies on wafer level chip scale package (WLCSP). Works were conducted in the frame of silicon platform developments for heterogeneous RF 3D modules, where the interconnections number is lower than in digital applications but the silicon interposer larger than conventional WLCSP. Several...
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