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IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 12 > 2036 - 2044
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 12 > 2027 - 2035
IEEE Transactions on Computer-Aided Design of Integrated Circuits and... > 2017 > 36 > 11 > 1856 - 1868
IET Computers & Digital Techniques > 2017 > 11 > 5 > 190 - 196
IET Microwaves, Antennas & Propagation > 2017 > 11 > 10 > 1424 - 1431
IEEE Transactions on Semiconductor Manufacturing > 2017 > 30 > 3 > 227 - 235
Microprocessors and Microsystems > 2017 > 51 > C > 76-98
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2017 > 25 > 5 > 1703 - 1713
International Journal of Parallel Programming > 2017 > 45 > 6 > 1420-1460
IEEE Transactions on Emerging Topics in Computing > 2017 > 5 > 2 > 179 - 192
Journal of Signal Processing Systems > 2017 > 87 > 3 > 327-341
IEEE Transactions on Electron Devices > 2016 > 63 > 12 > 4998 - 5003
IEEE Transactions on Electron Devices > 2016 > 63 > 12 > 4880 - 4887
International Journal of Heat and Mass Transfer > 2016 > 103 > C > 1359-1370
IEEE Transactions on Semiconductor Manufacturing > 2016 > 29 > 4 > 292 - 298
Electronics Letters > 2016 > 52 > 21 > 1815 - 1816