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In this work we present how to enhance the thermal performance of plastic laminate LED substrates by heat spreading and thermal vias. We introduced LEDs with a horizontal current flow in order to achieve the enhancement of thermal performance. We designed a thermally enhanced demonstrator, performed thermal simulations and compared it to previous simulation results. We built this thermally improved...
We demonstrate a hybrid silicon micro-ring laser design with novel thermal shunts. With this technique the hybrid silicon ring lasers with a 50 μm diameter operate continuous wave up to 105 °C.
A novel approach for the fabrication of α-Al2O3, mullite (Al6Si2O13) and AlN multiphase ceramic layer on WCu via sintering process accompanied with mixing PCS/AlN composite slurry by ball milling was described. The sintering process parameters such as water vapor content and raw material ratio were mainly studied in this paper which greatly affected the formation of ceramic layers. At last, the interfacial...
A novel approach for the fabrication of α-Al2O3, mullite (Al6Si2O13) and AlN multiphase ceramic layer on WCu via sintering process accompanied with mixing PCS/AlN composite slurry by ball milling was described. The sintering process parameters such as water vapor content and raw material ratio were mainly studied in this paper which greatly affected the formation of ceramic layers. At last, the interfacial...
Heat dissipation is a major challenge in high performance electronic devices. Current thermal interface materials (TIMs) have either low conductivity, such as conventional thermal greases, or high costs, such as solder materials and indium metals. [1-2] We address TIM challenges by integrating silver nanoparticles (AgNPs) and copper micropowders (CuMPs) in a resin-free TIM paste. The nanocomposite...
Thermal integrity is one of the most important challenges faced by three-dimensional integrated circuits (3D ICs). Towards this, thermal through-silicon-vias (TTSVs) have been widely used to assist heat dissipation. The metal inside TTSVs can conduct heat more effectively than the silicon substrate, and the metal bumps underneath TTSVs can help heat penetrate through the inter-layer thermal interface...
Recent work has clearly demonstrated that bonding a photonic crystal (PhC) membrane on to a low-index substrate such as sapphire is a viable means to make lasers that operate continuous wave (CW) at room temperature. Though the substrate (which has a refractive index larger than that of air) reduces the quality (Q) factor, as compared to a suspended membrane, it also greatly increases the thermal...
The high-density interconnection substrate invariably poses enormous difficulty to thermal design analysts due to complex metal layout patterns embedded in the dielectric matrix. A modeling method is proposed, which produces effective thermal conductivity values for elements of the substrate under a specified boundary condition. A novel parameter, the indexed metal volume fraction, is employed to...
This paper describes a 1 mm thick substrate with integrated flow channels to circulate liquid metal that is pumped with an electromagnetic pump. The substrate was fabricated using conventional circuit board assembly methods. Tests were performed with pumping current of up to 10 amps, which corresponded to a pumping power of 450 mW. This testing showed that the substrate had an effective thermal conductivity...
GaAs based hetero-junction bipolar transistors (HBTs) offer high speed and good device matching characteristics that are attractive for many high-speed circuits. However, thermal behaviors with multi-fingers can significantly affect HBTs performance. In this paper, three dimensional (3-D) finite-element modeling (FEM) approaches are built up to analyze the maximum temperature region and temperature...
Metallization provides electrical routing and serves as thermal via in LTCC (Low Temperature Cofired Ceramic) technology. High electrical and thermal conductivity is desirable. It is often achieved with the use of low electrical resistance materials, such as gold, silver and copper. The conductive paste made of these materials is expensive. Hence, the fabrication of LTCC has to be performance-wise...
SiC power semiconductors can safely operate at a junction temperature of 500degC. Such a high operating temperature range can substantially relax or completely eliminate the need for bulky and costly cooling components commonly used in silicon-based power electronic systems. However, a major limitation to fully realizing the potential of SiC and other wide band-gap semiconductor materials is the lack...
The polycrystalline samples of BaSi2, SrSi2, and LaSi were prepared by spark plasma sintering (SPS). The electrical resistivity (rho) and Seebeck coefficient (S) were measured above room temperature. The S of BaSi2 was negative and the absolute values were rather high (-669 muVK-1 at 337 K). The S of SrSi2 was positive and the absolute values were lower (118 muVK-1 at 332 K) than those of BaSi2. For...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
In this study, we fabricated in-plane thermoelectric micro-generators (4 mm times 4 mm) based on bismuth telluride thin films by using flash evaporation method. The thermoelectric properties of as-grown thin films are lower than those of bulk materials. Therefore the as-grown thin films were annealed in hydrogen at atmospheric pressure for 1 hour in a temperature range of 200 degC. to 400degC. By...
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