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Using a dedicated test vehicle (low-k planar capacitor) for studying the intrinsic properties of low-k materials and using standard single damascene 50 and 90 nm ½pitch test vehicles, differences in reliability behavior between intrinsic and integrated SiOCH porous low-k materials were investigated. The studied parameters were leakage current, breakdown field, distributional shape of failure times...
For decades soldering has been the technology of choice in die bonding. However, due to worldwide health protection regulations, the most common solder alloys, which contain lead, have been banned. Furthermore, standard solders cannot fulfil the reliability requirements of future power electronic devices. New interconnection technologies have to be developed. One of them is pressure sintering (p=30...
Main objective of this study is to design and development of multi-die embedded micro wafer level packages (EMWLP) reliability test vehicles. Such as, the laterally placed die EMWLP and the vertically stacked thin die EMWLP. For reliability evaluation, EMWLPs have been subjected to both environmental and mechanical reliability tests as per JEDEC standards. These reliability tests include highly accelerated...
Long-term field-reliability of gallium nitride (GaN) and silicon carbide (SiC) power switching devices is critically discussed in terms of bulk material defects. A new static reverse bias stress test circuit with a reactive load is proposed to delineate devices prone to field-failures.
This paper investigates the impact of pulse induced charging on RF-MEMS capacitive switches. The main goal here is to better understand the charging and discharging process involved in high field discharges. This is a necessary study for the reason that the reliability of the structure is directly affected by the underlying charging/discharging processes. Electrostatic discharge (ESD) experiments...
New amorphous oxide semiconductor transparent thin film transistors (TTFTs) exhibit good mobility (5 to >50 cm2/V-sec), are transparent, and can be processed at low temperatures. They show great promise for high performance large area electronics applications such as flexible electronics, transparent electronics, and analog current drivers for OLED displays. An overview of TFT operation, expected...
Package is a key factor, and affects the reliability of LED. In this paper, the main failure modes and mechanisms that caused by poor package process were investigated through some failure analysis cases, and some improving methods to improve the LED's reliability are put forward.
The application of laser based materials processing for precision micro scale manufacturing in the electronics and Semiconductor industry is widespread and accepted. With the explosive growth and need for enhanced manufacturing capacity in the solar industry, this capability is now being applied and refined for solar cell manufacturing. The motivation comes from a need for ongoing improvements in...
This paper will describe a new technique to increase the reliability of wafer-level packages (WLPs). The technique enables the placement of a protective coating around the solder balls using a maskless process and provides improved reliability performance as compared to unprotected devices. In addition, the unbonded devices allow for easier handling. This approach also minimizes form factor requirements...
The introduction of lead-free bumps into flip chip packages in combination with the incorporation of Cu / low-k or ultra low-k dielectric materials is making underfill development more challenging. The traditional concept of stiff and rigid underfills does not satisfy the new device reliability requirements. Rather, newer generation underfill materials need to balance the physical properties, such...
For advanced wafer-level chip scale packages (WLCSP), board level solder joint reliability is a major concern, and typical stress-relieving methods such as capillary underfills and molding compounds are costly. One method of low cost reliability improvement for WLCSPs is the use of a wafer level SolderBracetrade coating, which delivers improved reliability with minimal material and capital cost. In...
Copper/Low-k structures are the desired choice for advanced integrated circuits (ICs) as the IC technology trends moving toward finer pitch, higher speed, increased integration and higher performance ICs. Copper interconnects with low-k dielectric material improves the ICs performance by reducing interconnect RC delay, cross talk between adjacent metal lines and power loss. However, low-k materials...
The technique of wafer level chip scale package (WLCSP) is similar as flip chip packages without using underfill. The weakest point is solder joint reliability issue so the package size of WLCSP in current industry is used less than 10times10 mm2. In this paper, we use 5.5times5.5 mm2 package size to take as test vehicle and focus on ball peeling and shear stresses to assume and simulate drop test...
Flexible Printed Circuit (FPC) boards are being widely used for a number of applications to enable products in a three dimensional format thereby utilizing the “dead” space within the product envelop. During the past few years, the usage and complexity of FPC made of polyimide, polyester or teflon have grown substantially and are expected to continue to grow even more in the next coming years. In...
This paper presents the results of extensive simulations on the characterization of asymmetrical channel device, namely Dual material Gate Fully Depleted Silicon On Insulator (DMG-FD-SOI) in the sub-100nm dimensions with emphasis on the analog, radio frequency (RF) performances and short channel effects (SCEs). The obtained results may serve as useful guidelines to get a basis overview of this gate-material...
The following topics are dealt with: planar SOI devices; SOI memories; SOI photonics, MEMS, sensors and circuits; materials and 3D technologies; multi-gate SOI devices; SOI radiation effects and RF applications; device characterization, reliability, and modeling.
The aim of qualification is to verify whether a product meets or exceeds the reliability and quality requirements of its intended application. Qualification plays an important role in the process of product development. It can be classified by its specific purpose at different stages of the product development process. In this paper, a new methodology of product qualification is proposed based on...
Novel 3D stacked gate-all-around multichannel CMOS architectures were developed to propose low leakage solutions and new design opportunities for sub-32 nm nodes. Those architectures offer specific advantages compared to other planar or non planar CMOS devices. In particular, ultra-low IOFF (< 20 pA/mum) and high ION (> 2.2 mA/mum) were demonstrated. Moreover, those transistors do not suffer...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
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