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A reduced order model based on proper orthogonal decomposition (POD) has been applied to a multi-fin SOI field effective transistor (FinFET) to develop a compact thermal model. The approach projects the simulation domain onto a function space in order to reduce the numerical degrees of freedom (DOF). The approach does not require any assumption about the physical geometry, dimensions, or heat flow...
With the decreasing sizes of transistors and the increasing integrated circuit (IC) density, heat dissipation can be a limiting factor in developing emerging semiconductor technologies, such as silicon-on-insulator (SOI) based transistors and 3D-stacked ICs. To overcome this challenge, accurate thermal simulations are needed. The goal of this investigation is to explore the use of proper orthogonal...
A simple concept of characteristic thermal length is used to develop a physics-based compact thermal circuit model for the multi-gate field effective transistor (MuGFET) structure including the device channel, fins, source/drain/poly pads, metal contacts, poly wire and metal mires. The characteristic thermal lengths are used to represent various heat loss paths of heat conduction along each segment...
This paper reports the steady-state and transient temperature response of AlGaN/GaN high electron mobility transistor (HEMT) based structures. In this study, three localized heating schemes, namely, continuous self-heating, pulsed self-heating and heating with on-chip heaters are studied for sensor applications that require controlled heating profiles. Two scenarios were considered for the GaN sensor...
This paper presents an overview of evolving phosphor converted light emitting diode (LED) technology employed in general lighting applications. Its aim is to present technical developments alongside discussion regarding commercial implications and constraints. It integrates a number of elements that typically remain rather disparate. In itself the material does not represent a technological breakthrough...
Effect of compact thermal packaging approaches and challenges are investigated for a next generation automotive LED lighting. A challenging three-purpose in one (3i1) highly packaged light emitting diodes (LEDs) lighting system has been studied computationally and experimentally. A tightly packed light engine printed circuit board (PCB) with both LEDs and electronics in a very hermetically sealed...
Solid state light sources, such as light emitting diodes (LEDs), provide many inherent benefits and will dominate the lighting industry in the coming decades. While much of the industry is currently focused on packaging LED technology in standardized 19th century form factors to address the massive installed base of traditional fixtures, the unique characteristics of solid state devices can and will...
High heat flux management schemes in laser diodes require appropriate cooling applications. Micro channel coolers are now widely used in high power laser diode industry with the highest total thermal resistance reported as low as 0.03 cm2-K/W with pressure drops as low as 10∼50 psi. Since, the geometries, flow rates as well as high heat fluxes of current SOA LD micro-coolers differ, it is necessary...
With efficiencies in the range of 50–75%, significant amount of waste heat is generated during the operation of high power laser diodes. In order to maintain consistent optical performance, the temperature of the laser diode needs to be managed effectively. Single phase copper microchannel coolers (MCC) with high purity and low electrical conductivity de-ionized water (DIW) at high velocities are...
In this paper, we present a generic modeling study of the interposer package thermal performance as a function of the interposer thermal properties and thickness for different temperature specifications. The modeling study is based on an extensive DOE of thermal finite element simulations that extract the maximum allowable logic power as a function of the interposer properties. A graphical representation...
Core scaling has largely replaced frequency scaling in general purpose microprocessors in the last decade. This is largely because of the high temperature and power dissipation associated with frequency scaling in traditional air cooled systems. In this paper we investigate how this trend changes when micro-fluidic cooling is added to a chip. Compared to traditional air cooling, micro-fluidic cooling...
During the design of 2.5D and 3D integrated systems the thermal management of the whole system is important, especially in high performance systems with combinations of processor and memory dies utilizing the Wide I/O memory interface. Because cooling solutions could be very expensive they should be considered in very early design cycles. For example, the decision if the system is implemented as a...
Through-Silicon-Vias (TSVs) enable 3D stack of logic processor and memory dies with significant improvement in latency and energy efficiency of large memory-bound computations. However, additional layers of memory die increase IC package thermal resistance. Thermal management has been identified as a key challenge to achieve high computation power and memory density in the same package. In this paper...
Thermal aware design of integrated circuits is essential to avoid reliability issues and failures especially in 3D-technology where active dies are placed on top of each other and more heat is dissipated on the same area available for cooling compared to conventional 2D-packages. A certain number of parameters can be selected to reduce temperature and temperature gradient. This paper is mainly focusing...
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