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Recently, high thermally conductive polymers have emerged as low cost and energy efficient alternatives to traditional use of metals in heat transfer applications. Here, we present development of ultra-high molecular weight polyethylene (UHMWPE) thin films with high thermal conductivity. The fabrication platform is based on a sol-gel process followed by mechanical drawing. After gel formation and...
An experimental study is performed to characterize the effect of squeezing conditions on the particle distribution and bond line thickness of particle filled polymeric thermal interface materials (TIM). Two different commercial particle-filled polymeric TIMs with different particle volume fractions have been used in this study. Rheological properties such as yield stress and viscosity are measured...
The mechanical properties of polymer materials are often a key concern of the microelectronic packaging industry. The theoretical analysis of stress, strain, and deformation induced in electronic assemblies due to environmental exposures such as moisture adsorption, isothermal aging, and thermal cycling require the complete characterization of mechanical properties and constitutive behavior of the...
In this study, several 2D numerical simulations on a non-Newtonian flow over a confined cylinder placed in a rectangular microchannel are carried out at different Weissenberg (Wi) numbers. In particular, the Oldroyd-B model implemented in open source code OpenFOAM is employed to capture the three basic ingredients of polymer rheology, viz., anisotropy, elasticity and relaxation. Numerical calculations...
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