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A reduced order model based on proper orthogonal decomposition (POD) has been applied to a multi-fin SOI field effective transistor (FinFET) to develop a compact thermal model. The approach projects the simulation domain onto a function space in order to reduce the numerical degrees of freedom (DOF). The approach does not require any assumption about the physical geometry, dimensions, or heat flow...
Ensuring adequate thermal performance is essential for the reliable operation of flip-chip electronic packages. Thermal interface materials (TIMs), applied between the die and a heat spreader form a crucial thermal junction between the first level package and external cooling mechanisms such as heat-sinks and cooling fans. Selection of a good TIM is dependent not only on its thermal properties but...
This paper discusses a thermal reliability testing experiment and failure analysis (FA) in 32nm SOI Si technology chip packages. Thermal performance of the TIM materials is monitored and physical failure analysis is performed on test vehicle packages post thermal reliability test. Thermomechanical modeling is conducted for different test conditions. TIM thermal degradation is observed at the chip...
Replacing Silicon Dioxide (SiO2) with low-k and ultralow-k (ULK), as a dielectric, in the Back-End-Of-Line (BEoL) has allowed the trend of miniaturization and convergence to continue. Although using low-k and ULK greatly increases the device performance, being mechanically weak these dielectric materials pose a serious challenge from the reliability standpoint. Delamination along the metal-dielectric...
Semiconductor industry has recognized the need to replace traditional Al/SiO2 interconnects with Cu/Low-k interconnects in the mainstream electronics devices following the latter's impact on power, RC delay, and cross-talk reduction. However due to lower elastic modulus, strength, and poor adhesion characteristic, reliability of the Cu/Low-k interconnects turns out to be a concern for its integration...
One of the most critical failure modes in a BGA package is the solder interconnect failure (2nd level). Conventionally, the solder damage is due to the mismatch of coefficient of thermal expansion (CTE) between the various package components and the PCB. It is absolutely critical to identify and minimize the BGA damage under thermal cycling to improve the package reliability. In the past, the critical...
Surveillance systems have presented to be important applications for high performance thermal control devices, especially passive ones using heat pipe technology. This is usually applied when the heat source is located far from the heat sink and the use of liquid cooling or any other active thermal control system is not possible. Design and application of pulsating heat pipes (PHPs) and heat pipes...
The trends towards miniaturization in the electronics industry coupled with advances in flip chip technology have increased the use of flip chip on board or direct chip attach technology in many products. This is especially true for products where re-work is not an option. Reliability issues were overcome by the use of underfill to couple the chip to the substrate and subsequently significant advances...
Mechanical integrity of the dielectric stack is challenged by the trend towards porous, lower dielectric constant interlayer dielectric (ILD) materials. As a result, fracture in the ILD stacks caused either by assembly process or by the dicing process is an important reliability consideration. In general, there is a need to either assess the propensity of the structure to fracture under assembly conditions,...
Presence of a thermal enabling load applied to Ball Grid Array (BGA) components creates a distinctive set of evaluations to be completed for reliability of solder joints (SJ) that connect the BGA to the board. This becomes especially relevant for newer technologies that drive to smaller component form factors. In this comprehensive study, a computational mechanics based Design of Experiments approach...
Flip chip technology has attracted much attention in electronic industry as it fills the need for low cost, miniaturization and high performance requirements of electronic products. For such devices, package reliability under drop impact is a great concern to the manufacturers as these electronic packages are very much vulnerable to solder joint failures caused by the mechanical shock and the PCB...
The traditional approach of thermo-mechanical (T-M) reliability modeling is based on power cycle events. This approach is not useful for products which are rarely powered down, because power cycles alone do not capture all the reliability stress from temperature variation over these products' use life. This paper describes a methodology to determine the temperature cycle requirements for products...
Data centers consume a significant amount of energy in the US and worldwide, much of which is consumed by the cooling infrastructure, particularly the chiller plant and computer room air conditioners and air handlers. To enable energy efficient data center designs, ASHRAE added two new IT environmental classes, A3 and A4, with associated allowable inlet air temperatures of 40C and 45C respectively...
Operational expenses of servers and the data center to support them account for a significant part of the total cost of ownership of a data center and potentially the total business. Manipulating the inlet temperature to the servers can provide a possible method of lowering the operating cost of a data center. Conventional wisdom regarding management of the cold aisle temperature in the data center...
The demand for power electronic systems to operate in harsh environmental conditions has increased over the past 20 years. These environments include those relating to deep oil-well drilling, automotive and aerospace applications. The miniaturization of the power module along with higher power densities have created elevated stress levels on ancillary subsystems, specifically the control circuitry...
An investigation of a solid-state lighting (SSL) luminaire with the focus on the electronic driver which has been exposed to a standard wet hot temperature operating life (WHTOL) of 85% RH and 85°C in order to assess reliability of prolonged exposer to a harsh environment has been conducted. SSL luminaires are beginning introduced as headlamps in some of today's luxury automobiles and may also be...
Solid-state lighting (SSL) products can have a predicted life of 70% lumen output (L70) from 26,000 to 40,000 hours using the LM-80-08 testing standards. Chromaticity shift, correlated color temperature (CCT) and lumen maintenance (LM) will dramatically reduce the nominal life of SSL luminaires. In this work, an off-the-shelf luminaire from Philips (AmbientLED) has been aged in a standard wet hot...
Micro-electro-mechanical systems (MEMS) devices are used in a variety of applications for sensing acceleration, translation, rotation, pressure and sound in addition to actuation and signal generation. The MEMS devices have been applied to varied fields including healthcare and automotive applications. Data on reliability degradation of MEMS devices in harsh environment applications including combined...
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