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Currently, a variety of Thermal Interface Materials (TIMs) are required to meet specific requirements for various products with no single TIM meeting the needs for all CPU market segments. Surface treatments, reflow temperatures, mechanical load, performance targets all play a role in choosing a specific TIM. Based on the above multitude of conditions, it is desirable to find a universal TIM that...
With increasing power density in electronics packages/modules, thermal resistances at multiple interfaces are a bottleneck to efficient heat removal from the package. In this work, the performance of thermal interface materials such as grease, thermoplastic adhesives and diffusion-bonded interfaces are characterized using the phase-sensitive transient thermoreflectance technique. A multi-layer heat...
Thermoelectric generators (TEGs) can improve the net power consumption of electronic packages by generating power from the chip waste heat. In this study, a 3D computational model of electronic package with silicon nanowire (Si-NW) based embedded TEGs has been developed and the effect of crucial geometric parameters, contact resistances and thermal properties such as pitch length and length of Si-NWs,...
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