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A simple concept of characteristic thermal length is used to develop a physics-based compact thermal circuit model for the multi-gate field effective transistor (MuGFET) structure including the device channel, fins, source/drain/poly pads, metal contacts, poly wire and metal mires. The characteristic thermal lengths are used to represent various heat loss paths of heat conduction along each segment...
Nowadays, thermal designers have to deal with sophisticated 3D component packaging, enclosing several chips or conventional individually-packaged Integrated circuits with various power densities, embedded in small volumes that will drive up the complexity of their thermal management.
Compact thermal modeling of hand-held and ultra-low power microelectronic systems has recently attracted a great deal of attention. In this study time-dependent evolution of heat transfer around a flat plate was numerically investigated. The flat plate is subjected to internal heat generation from the inner boundary via a discrete heat source. It is cooled on the outer boundary via buoyancy and radiation...
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