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The build-up substrates have been used for flip chip packages in high speed and high performance applications for a long time in a variety of layer stacked substrates such as 3+N+3 or 4+N+4. Because of the needs in high speed applications, the device's frequency is running fast and the package performance need be improved to achieve such high performance demand. One of solutions is to reduce the core...
The purpose of this paper is to analyze the bump height variation and probe mark profile with various bump materials for wafer probing. It is necessary to establish different material bump wafer probing criteria, because the bump height variation and probe mark area have severe influence on the sort flip chip wafers that will affects the quality of the contact behavior and further impacts the flip...
Considering that the mechanical behavior plays a very important role in the packaging reliability, this study examined the shear deformation properties of pure Sn joints with different substrate materials and various gap sizes. The proeutectic Sn dendrites were refined and the shear strength was increased with a shrunken sample gap. The interfacial intermetallic compounds (IMCs) were thickened slightly...
We derive in this paper equations of motion of board-level IC packages subjected to swept sine vibration loads following the support excitation scheme. Harmonic analysis is performed based on the argument such that at each loading state over the swept sine process, hysteresis responses of solder joints following the isotropic hardening rule vanish fairly quickly so that plasticity is fully developed...
We perform the sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, to examine thermal characteristics along with fatigue reliability of a board-level stacked-die package under coupled power and thermal cycling test conditions. Different powering conditions and sequences are compared. From the numerical...
The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level stacked-die package under coupled power and thermal cycling test conditions. Different powering conditions and sequences are compared. From the numerical...
In the study, one 14x14 lead free CSP BGA with 0.3 mm/0.5 mm ball diameter/pitch was adopted as test vehicle. The intermetallic compounds morphology evolution which can be generated when using SnxAgCu and SnAgCuX solder ball in combination with electrolytic NiAu-plated substrates was investigated during 150degC thermal aging, such as single layer SnNi IMC and complex layer SnNi/SnNiCu IMC in the interface...
This work presents electromigration reliability and patterns of Sn-3Ag-0.5Cu and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy (UBM), bonded on Au/Ni/Cu substrate pads. The solder joints were subjected to an average current density of 5 kA/cm2 under an ambient temperature of 150degC. Under the situation when electron charges flow from the UBM towards...
In this study, the sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of board-level stacked-die thin-profile fine-pitch ball grid array chip-scale packages under coupled power and thermal cycling test conditions. Effects...
The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this...
In this paper, the Taguchi optimization method is applied to obtain the optimal and robust design towards enhancement of board-level thermomechanical reliability of a package-on-package stacking assembly under an accelerated thermal cycling test condition. An L18(2 1times37) orthogonal array is arranged for the optimization of eight selected control factors of the assembly, including thickness of...
Designed experiments are conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn-3Ag-0.5Cu flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Electromigration patterns are investigated in solder bumps under a current stressing condition with an average current density of about 5 kA/cm2 at an ambient temperature...
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