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This paper introduces concept and functionalities of two novel electronic design automation EDA Tools for system planning and 3D layout design of smart items. These tool functionalities allow first feasibility decisions and pre-layout analysis in a early design stage. Thus, the quality of the design process can be ensured and expensive re-design can be avoided.
Today's packaging is facing intensified challenges as modern electronic devices seek to combine a larger number number of functions in a tight space in various environments. This results in chip designs determined by more complex circuitries and the use of fine pitch and micro bumps, as well as challenging interconnection properties. Selecting the best suitable interconnection technology is important...
Injection overmoulding enables cost-efficient and fully integrated manufacturing of sealed flexible electronics devices with complex optical and mechanical functionalities. Furthermore, the electrical performance of the system can be improved by adding inorganic components on printed, flexible foil before in mould integration of the structure. The development of such the manufacturing process combining...
The dynamical behavior of temperature is becoming a critical design consideration for the Modular Multilevel Converter (MMC). Investigation of an advanced control structure for Grid Connected-Modular Multilevel Converter (GC-MMC) is proposed in this paper. To achieve this goal, an non-linear model of MMC regarding considering of negative and positive sequence components with thermal dynamics has been...
The three year EU project SMARTER-SI that started in February 2015 has developed and tested a new production platform for smart systems that offer SMEs and “mid-cap” companies help to manufacture small and medium volumes. The ultimate goal of this project is to test a new concept for small lot production, which we call the Cooperative Foundry Model (CFM). The CFM is tested by combining components...
In this paper, the effect of silicon (Si) cap packaging on the BiCMOS embedded RF-MEMS switch performance is studied. The RF-MEMS switches are designed and fabricated in a 0.25µm SiGe BiCMOS technology for K-band (18 – 27 GHz) applications. The packaging is done based on a wafer-to-wafer bonding technique and the RF-MEMS switches are electrically characterized before and after the Si cap packaging...
It is believed that conformal metallization on glass with the highly conductive thick Cu material is expected to enhance the performance for RF electronic devices in the IoT era due to the outstanding RF properties of the glass and high-Q nature of Cu metallization. Previously, metallization on the glass with sputtering and printing technology is demonstrated. However, there are some concerns in terms...
An experiment was designed using optimal design of experiments to identify the most relevant parameters in an assembly step for a smart tag; the soldering of 0402 resistors to a polyimide backplane. The parameter window was set to reflect natural variations in production, and parameter variations were investigated to ascertain whether these variations could lead to unacceptable values of electrical...
Motor drives are used in various industrial processes. Some of the operational environments of the drives may contain contaminations like dust, salts and gases. Dust combined with humidity may cause electrical shorts, decreased insulation resistance, and corrosion on the electronics of the device. Therefore, it is essential to study the behavior of the devices under such conditions. In this study,...
A novel bending machine has been designed and tested. It enables flexible electronics to be subjected to repeated bending with constant radius and tension. In-situ electrical characterization can give accurate analysis of lifetime distributions if sufficiently many samples are ran to failure, allowing reliability prediction models to be developed. Four sets of test samples with different combinations...
Electronics density continue to increase which impacts the power density and thermal hot spots on the printed circuit boards. The reliability and prediction of the electronics failure rate is often related to the thermal stress induced during different operating conditions at the board. To get information about the environmental conditions and to assist in the prediction of a product's failure rate...
Next generation RF sensor modules for multifunction active electronically steered antenna (AESA) systems will need a combination of different operating modes, such as radar, electronic warfare (EW) functionalities and communications/datalinks within the same antenna frontend. They typically operate in C-Band, X-Band and Ku-Band and imply a bandwidth requirement of more than 10 GHz. For the realisation...
We propose new type chemical wet cleaning process of metal layer for high reliability device and TSV process. Here we study our new type novel chemicals to obtain lower metal etching rate at photo resist developing & stripping process, PI film developing and TSV via cleaning process application. And we found out this chemical system can remove fluoride contamination & residue at RIE, dry etching...
In this work, an on-chip Monolithic Microwave Integrated Circuit (MMIC) to waveguide transition is realized based on Linearly Tapered Slot antenna (LTSA) structure. The antenna is implemented on a 50-um-thick Gallium Arsenide (GaAs) substrate and placed in the E-plane of an air-filled D-band waveguide. The transition shows a maximum insertion loss of 1 dB across the frequency range 110–170 GHz. The...
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