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Previous studies have discovered a unique type of nanostructured polymer-metal composite for thermal interface material with effective thermal conductivity of 8 W/mK. It is a promising result but extensive efforts are still required to further enhance the thermal conductivity. Therefore, this paper will try to help the process with modeling and simulation. Calculations reveal the alignment of the...
Stem cell growth and migration on nanofibrous scaffolds and micro-fluidic channels on Silicon-Chip were studied by using neural stem cells isolated from adult rats' brain. Electrospinning and lithographic technique were used for developing nanofibrous-polylactic acid (PLA) and polyurethane (PU) based-scaffolds and micro-fluidic channels on Si-Chips respectively. Immunocytochemical and morphological...
An urgent need for improved thermal management of microelectronic systems has emerged as a direct consequence of increasing integration densities, both at chip and packaging level. Current thermal interface materials have been identified as a major bottleneck, hindering reduction of junction to ambient thermal resistance to future required levels (< 0.2 KW-1). In this paper we introduce and characterize...
This paper reviews the status and recent progress achieved in the research of thermal interface materials (TIMs). The focus is on the research work performed in academia. The research and development work carried out in industry is also generally introduced. The existing TIM technologies have been categorized into eight main types and comprehensively analyzed. The state-of-the-art-research is then...
Continued miniaturization in combination with increased performance of microelectronics has generated an urgent need for improved thermal management techniques in order to maintain reliability of systems and devices. Development of advanced thermal interface materials has been identified as crucial, absorbing a portion of the advancements necessary within packaging technology. In this paper we introduce...
Electrospinning is a historical technology which has existed for over seventy years. Recently, it has been introduced to make a novel electrospun nanofiber based thermal interface material (nano-TIM). Until now, there are few articles on the dielectric properties of nanofiber. Since the electrical insulation property is an important parameter for thermal interface materials, we investigated the dielectric...
Continued miniaturization, increased performance, as well as increased reliability of microelectronics require development of new design and manufacturing methods. Embedding discrete passive components into the substrate has been identified as a solution capable of accommodating a portion of the future demands on microelectronics. As embedded passive components are fundamentally different from discrete...
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