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The paper describes a modeling tool developed to evaluate environmental impact of both HDI and conventional PWB fabrication processes. It includes impact of energy, water, and process chemicals. It also factors energy generation source based on manufacturing locale. Several product emulators will be used to demonstrate how the modeling tool can be used to assess impact of interconnect design alternatives...
One of the significant bottlenecks in thermal management is to develop thermal interface materials (TIMs) with lower thermal interface resistance while retaining good reliability, mechanical properties and handling capabilities. Recently, the combination of electrospun polymer fibers and solder matrix has gathered interest, combining the excellent thermal properties of metal with the mechanical properties...
An experiment was designed using optimal design of experiments to identify the most relevant parameters in an assembly step for a smart tag; the soldering of 0402 resistors to a polyimide backplane. The parameter window was set to reflect natural variations in production, and parameter variations were investigated to ascertain whether these variations could lead to unacceptable values of electrical...
Today's packaging is facing intensified challenges as modern electronic devices seek to combine a larger number number of functions in a tight space in various environments. This results in chip designs determined by more complex circuitries and the use of fine pitch and micro bumps, as well as challenging interconnection properties. Selecting the best suitable interconnection technology is important...
Motor drives are used in various industrial processes. Some of the operational environments of the drives may contain contaminations like dust, salts and gases. Dust combined with humidity may cause electrical shorts, decreased insulation resistance, and corrosion on the electronics of the device. Therefore, it is essential to study the behavior of the devices under such conditions. In this study,...
Wafer level packaging technology, maintaining the same size as the die, is a true chip scale packaging technology offering smallest possible footprint and increased electrical performance. Keeping balance between cost and quality becomes an important point in WLCSP industrial practice. In our work, six kinds of WLCSP samples were designed in order to find out the real reliability contribution of UBM...
Electrically conductive adhesive is a new type of environmentally interconnect material which can be used in electronic packaging to replace the traditional solders due to its advantages of simple applying process and low curing temperature. Silver coated graphene is employed in this work to enhance the thermal conductivity of the current commercial electrically conductive adhesive with very low thermal...
Sensor components are used increasingly in various applications. The structure of a sensor component often differs from that of a typical silicon chip used in electronics, which may make their attachment and packaging challenging. Isotropic conductive adhesives (ICA) may be used in many applications which have such restrictions. ICAs consist of polymer binder, into which conductive particles are added...
The dynamical behavior of temperature is becoming a critical design consideration for the Modular Multilevel Converter (MMC). Investigation of an advanced control structure for Grid Connected-Modular Multilevel Converter (GC-MMC) is proposed in this paper. To achieve this goal, an non-linear model of MMC regarding considering of negative and positive sequence components with thermal dynamics has been...
In this paper, the effect of silicon (Si) cap packaging on the BiCMOS embedded RF-MEMS switch performance is studied. The RF-MEMS switches are designed and fabricated in a 0.25µm SiGe BiCMOS technology for K-band (18 – 27 GHz) applications. The packaging is done based on a wafer-to-wafer bonding technique and the RF-MEMS switches are electrically characterized before and after the Si cap packaging...
The three year EU project SMARTER-SI that started in February 2015 has developed and tested a new production platform for smart systems that offer SMEs and “mid-cap” companies help to manufacture small and medium volumes. The ultimate goal of this project is to test a new concept for small lot production, which we call the Cooperative Foundry Model (CFM). The CFM is tested by combining components...
An assembled printed circuit board has a number of components mounted on it. The components may be active or passive, high power or low power, but all of them produce heat during operation. During operation, heat is transferred from and to the PCB track by conduction through component leads, between components through air by convection or simply by radiation without any medium. In this paper the heat...
This paper studied the influence of polyimide (PI) on the wafer warpage and electrical leakage in the wafer bumping structure and process. The wafers with different thickness PI and different PI coverage were built. And the warpage of these wafers was measured before PI coating, and after PI curing. According to the result, the thicker PI and higher PI coverage on the wafer induce larger wafer warpage...
It is believed that conformal metallization on glass with the highly conductive thick Cu material is expected to enhance the performance for RF electronic devices in the IoT era due to the outstanding RF properties of the glass and high-Q nature of Cu metallization. Previously, metallization on the glass with sputtering and printing technology is demonstrated. However, there are some concerns in terms...
Injection overmoulding enables cost-efficient and fully integrated manufacturing of sealed flexible electronics devices with complex optical and mechanical functionalities. Furthermore, the electrical performance of the system can be improved by adding inorganic components on printed, flexible foil before in mould integration of the structure. The development of such the manufacturing process combining...
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