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Downsizing the Cu signal traces in the redistribution layer is an effective approach to increasing the number of signal I/O lines and thereby greatly increasing signal processing performance between logic and memory chips in advanced fine-pitch packaging. Downsized Cu traces, however, are vulnerable to current stress, which degrades electromigration resistance. This is a serious problem in advanced...
As electronic product becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic systems. Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wiring offer compelling benefits for 2.5D and 3D system integration;...
As electronic product becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic systems. Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wiring offer compelling benefits for 2.5D and 3D system integration;...
An enhanced redistribution layer architecture has been developed in which the Cu wires are directly covered with a double layer consisting of two types of dielectrics by using a semi-additive process. The double layer enhanced the thermal and electrical reliabilities of the Cu wires. Moreover, it enabled fabrication of a single-sided nine-level redistribution layer embedded with a fully stacked via...
High performance radio frequency (RF) front end filters were fabricated using glass interposer and 3D packaging technologies, especially through glass vias (TGV) and direct Cu metallization on the glass. Major challenges for the use of TGV in RF and electronics applications are the cost competitiveness, high throughput and reliable metallization of both TGV and flat glass surface with an excellent...
As electronic product becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic systems. Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wiring offer compelling benefits for 2.5D and 3D system integration;...
As electronic products becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic systems. Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wiring offer compelling benefits for 2.5D and 3D system integration;...
A Silicon interposer with through silicon via (TSV) has become important key components of 3D integration. It is used as an intermediate carrier and a wiring device for IC components like logics, memories, sensors, and so on. Due to wiring with custom design on front and back side, a TSV interposer enables to adapt the fine pitch IO terminals of the mounted ICs to the IO geometries of the package...
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