The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, performance of a directly attached airbag sensor for automobiles is analyzed for the signal characterization. The package was designed using the acceleration MEMS sensor on the flexible circuit board to attach directly on the frame surface using adhesive. For the signal characterization, impact tests were performed for the conventional sensor packaging and the directly attached sensor...
Due to the increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in mobile electronic products, there have been growing needs of wearable electronic products in near future. Wearable watches, glasses, wrist bands, shoes, and clothes have been recently introduced in the market. To realize wearable electronic products, there should be four core electronic hardware...
X-ray inspection on connectors becomes more and more important in these years as more connectors are mounted on PCBA due to their apparent benefits1-2. In this paper, we would like to share our studying experience for PCB Cavity Press-Fit connector on cavity PCB area. Our assembly with two press-fit connectors are inspected with the AXI, in order to make sure there is no broken pins enclosed inside...
The new trends in automotive electronics such as autonomous driving, in-car infotainment, and all-electric cars, require an entirely different electronic vision and technologies than are pursued today for automotive industry. Georgia Tech proposes system scaling as a new frontier to address the upcoming era of automotive challenges. It also proposes an innovative 3D system package architecture taking...
Over the past decade, the silicon photonics industry has made fantastic progress in implementing a wide range of optical and electro-optical devices using infrastructure and low-cost, high-volume, manufacturing technologies from the microelectronics industry. Many technical challenges have been solved. However, ultra-low loss light coupling at the interface between a high-index, sub-micron silicon...
Energy harvesting generators have been received research interest in recent years and these are attractive as inexhaustible replacements for batteries in low-power wireless electronic devices. We have fabricated epitaxial thin films on (001) SrTiO3 substrates. The films show very high structural quality and purely cube-on-cube orientation relationship between NaNbO3 film and SrTiO3 substrate. The...
High performance X-ray inspection systems are widely used in the PCBA manufacturing process. These include 2DX systems with sub-micron feature recognition that are equipped with 3D micro-CT (Computer Tomography) and Large Board CT 1-2 (also called Partial Angle CT and PCT). The Large Board CT functionality is extremely important in order to be able to perform 3D CT inspection of regions of interest...
Monitoring Wafer Level Reliability (WLR) tests are common to guarantee process stability and homogeneity. The test cost and test time efficiency are very important because of the high number of monitoring tests. Interconnects like metal lines and via structures are typically tested by higher temperatures on a thermo chuck because the possibilities for test acceleration are limited by Joule heating...
Digital Health is concerned with improving human health by utilizing such high profile applications of wearable and implantable technology, web and email, mobile technology and social networking, and data management and analytics. The changes that these technologies could bring to our lives have been well articulated, but there is a gap between the benefits that are envisioned and the challenges to...
Although bulk graphene in large sheets is a conductor, quantum confinement of electrons in narrow ribbons can be used to develop a variable and controllable band gap. The paper outlines devices operating in the GHz, THz, Far-IR and visible spectrum and methods used to produce them.
Spurred by the industrial demands for terabyte/s bandwidth graphics module, high bandwidth memory (HBM) has been emerged to overcome the limitations of conventional DRAMs. Additionally, due to the fine pitch and high density interconnect routing between GPU and 4 HBMs in 2.5D terabyte/s bandwidth graphics module, HBM interposer has also been to the force. However, several signal integrity issues of...
In the 2000s, red phosphorous flame retardants were at the root of widespread and costly failures in electronics products. The most prominent of these failures were in plastic encapsulated microcircuits. These failures were widely reported and painfully experienced. As a result, users of electronic components and finished products came to expect that technical diligence, marketplace forces, and the...
As the size of microbumps continues to shrink, the amount of solder decreases gradually, resulting the brittleness of solder joints due to formation of intermetallic compounds. Low-temperature Cu-to-Cu direct bonding appears to be one of the solutions for fine-pitch microbumps for 3D IC packaging. However, the high bonding temperature and pressure are the main problems of this approach. We achieve...
We have developed Cu-Cu/adhesives hybrid bonding technique by using collective cutting of Cu bumps and adhesives in order to achieve high density 2.5D/3D integration. It is considered that progression of high density interconnection leads to lower height of bonding electrodes, resulting in narrow gap between ICs. Therefore, it is difficult to fill in adhesive to such a narrow gap ICs after bonding...
Cognitive computing is capable of machine learning, recognition and proposal. It has a great potential to make human life richer, more productive and more intelligent. For the realization of the cognitive computing, an efficient and scalable non-von Neumann architecture inspired by the human brain structure has been developed and a device which demonstrates the concept was also built. This device...
A past paper discussed the trend of miniaturization in microelectronics and how this trend has driven the development of enhanced methods in acoustic micro imaging. However these methods have been developed in the majority of cases for the analyses of exposed silicon devices prior to encapsulation. Silicon is highly transmissive to the ultrasound allowing for high frequency/high resolution that is...
Novel bumping technology that can realize high density assembly of IC chips and packages with a high number of I/O is required in the field of electronic packaging. Currently, the electroplating method or the solder ball placement method have been widely adopted for the fabrication of solder bumps down to sub-hundred microns in diameter. However, there are some limitations with these current bumping...
Glass provides many opportunities for advanced packaging. The most obvious advantage is given by the material properties. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust the coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks for both through glass vias (TGV)...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.