The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
We developed a capacitive silicon on insulator (SOI) microelectro-mechanical systems (MEMS) tuning-fork gyroscope and describe its structure and performance.
Microelectromechanical systems (MEMS) vibratory gyroscopes are used in a wide range of applications. Gyroscopes which have long-term stability and high-reliability even when they are used in harsh environments such as in a wide range of temperatures will be useful for automotive systems and robotics applications. We report a deformation-robust gyroscope, which has three sets of symmetrically arranged...
In order to meet increasing demand for higher-speed signal transmission and smaller electromagnetic noise, we propose the hybrid optical interconnection module with built-in electrical power lines as highly practical optoelectronic interconnection in mobile phones. Highly-flexible integrally-formed OE-FPC with high productivity and reliability was utilized in this module. Optical semiconductor devices...
A high-performance 160 Gbps (=20 GB/s) optical semiconductor module using an optoelectronic (OE) ferrule with the ultra-compact size of 4.4 times 4.5 times 1.0 mm3 was developed for the first time in the world. The ferrule is used as the interface of OE converter in our developed optoelectronic LSI package of over 1 Tbps, POST LSI package (post-reflow optical-interface stacking technique LSI package)...
Attention has turned in recent years to optical interconnection as the most cost-effective solution to the problem of I/O bottlenecks in the wiring of conventional FR4 printed wiring boards. In this paper we propose a new configuration for the key element in realizing optical interconnections, a low-cost electrical/optical (E/O) converter module. We furthermore propose an easy splicer and a ribbonized...
In this paper, thermal stability in the multifinger GaInP/GaAs collector-up tunneling-collector heterojunction bipolar transistors (C-up TC-HBTs) has been investigated. Two unique structures in these C-up TC-HBTs are provided for thermal management for a stable operation. One is the base layer that is incorporated with highly resistive regions, which serves as a ballast resistor, due to the boron-ion...
A novel optoelectronic LSI package using a post-reflow optical-interface stacking technique (POST), which enables high speed operation at more than 10 Gbps/ch on the standard FR-4 PWB was proposed. The POST LSI package includes an interposer and an optical interface module. A slightly modified interposer is used where electrical contacts for high speed signals are added on the top surface. After the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.