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The Internet of Things/ Everything (IoT/E) will require billions of single or multiple MEMS/ Sensors integrated in modules together with other functional building blocks like processor, memory, connectivity, built-in security, power management, energy harvesting, and battery charging. The success of IoT/E will also depend on the selection of the right Packaging Technology. The winner will be the one...
NANIUM's Fan-Out Wafer-Level Packaging technology WLFO (Wafer-Level Fan-Out) is based on embedded Wafer Level Ball Grid Array (eWLB) [1]. Since it's invention almost 10 years ago, it became the leading technology for Fan-Out Wafer-Level packages. The WLFO technology is based upon the reconstitution to wafer format of semiconductor dies or other active / passive components separated by mold compound...
Current FOWLP (Fan-Out Wafer-Level Packaging) technology, eWLB (embedded Wafer-Level Ball Grid Array), has limited heat dissipation capability, as the materials used in, namely the EMC (epoxy mold compound), originally aimed process ability and mechanical stability, but not heat conduction. As eWLB technology expands to WLSiP (Wafer-Level System-in-Package) and WLPoP (Wafer-Level Package-on-Package)...
Embedded Wafer Level Ball Grid Array (eWLB) [1] since it's invention has been the leading technology for Fan-Out Wafer-Level package. The development of eWLB technology involving the patterning of a Redistribution Layer over a reconstituted wafer has been hampered by remaining metal from the test structures applied by the foundries in the dicing streets of the incoming Si wafers for process control...
The use of embedded Wafer Level Ball grid array(eWLB)[1] technology for the construction of single and multiple side by side die packages has become widespread since the introduction by Infineon technologies more than five years ago. The flexibility of this packaging to include different die material types such as Si and GaAs combined with excellent mechanical, electrical and thermal performance and...
Wafer reconstruction is a process of forming an integral handle-able wafer by filling the gaps between the dies after die-to-wafer assembly to allow for further processing on the landing wafer, e.g. thinning, redistribution layer deposition, and bumping. This paper examines key aspects and challenges of different wafer reconstruction process flows. Based on analytical and finite element method modeling,...
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