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To be compliant with electromagnetic compatibility standards, integrated circuits such as microcontrollers have to be robust to fast transient burst tests. Because of high voltage and fast transient voltage variations used no measurement is possible during the stress. Lack of information makes the debug of a product a real challenge. The objective of this work is to provide a measurement method which...
This work presents a new electrical characterization method of RLC structure using a Transverse ElectroMagnetic (TEM) cell. The measurement of a single bond wire welded between two pads on a copper board allows checking the consistency of our results with this method. Results are compared to those obtained thanks to probe tips. A typical RLC approach is employed to establish a model for the test structure...
This paper presents the design and simulations of an analog circuit able to reshape an input analog signal with amplitude higher than 100 mV and DC level included in the supply range. The circuit is dedicated but not limited to crystal oscillators and operates in the frequency range from 4 MHz to 48 MHz. The circuit is designed in 40 nm standard CMOS process technology. Simulation and post-layout...
To be compliant with electromagnetic compatibility standards, integrated circuits such as microcontrollers have to be robust to fast transient burst tests. The supply pins, their numbers and their respective positions, can have an influence on the robustness of circuits on ESD (ElectroStatic Discharges) and FTB (Fast Transient burst) tests. For cost reasons, this number of supply pins tends to be...
This paper presents an investigation work about the bond wire electrical performances, with the aim of designing an integrated time base using the bond wire inductance. Our work was focused on the characterization of single and double gold bond wire, and multi bond wire length for the frequency range from 500 MHz to 5 GHz. A lumped n-model is used for the modeling and the electrical parameters are...
This paper presents a full electromagnetic interference (EMI) study of high-performances 32-bit microcontrollers (MCU). First, two types of standard radiated emissions measurements have been executed on a device. Then, EMI modeling has been simulated with the help of a predictive SPICE model. Finally, modifications has been studied and implemented in order to reduce the EMI levels. The aim of this...
This paper presents a predictive SPICE model for the radiated ElectroMagnetic Interferences (EMI) of a 32-bit microcontroller. The aim of this work is to be able to predict, during the design stage, the level of electromagnetic emissions in order to establish pinout, design or layout rules. This model is intended to represent the EMI behavior of a microcontroller when it is running in a noisy mode...
This paper presents a predictive model for the ElectroMagnetic Interferences (EMI) of a 32-bit microcontroller running in a WFI (Wait For Interrupt) mode. The simulated results correlate well to the TEM-Cell measurements. In the future, this model will be extended to be able to simulate the microcontroller in other modes (digital core running, Flash Memory reading or writing, etc.). The model has...
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