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To be compliant with electromagnetic compatibility standards, integrated circuits such as microcontrollers have to be robust to fast transient burst tests. Because of high voltage and fast transient voltage variations used no measurement is possible during the stress. Lack of information makes the debug of a product a real challenge. The objective of this work is to provide a measurement method which...
This work presents a new electrical characterization method of RLC structure using a Transverse ElectroMagnetic (TEM) cell. The measurement of a single bond wire welded between two pads on a copper board allows checking the consistency of our results with this method. Results are compared to those obtained thanks to probe tips. A typical RLC approach is employed to establish a model for the test structure...
To be compliant with electromagnetic compatibility standards, integrated circuits such as microcontrollers have to be robust to fast transient burst tests. The supply pins, their numbers and their respective positions, can have an influence on the robustness of circuits on ESD (ElectroStatic Discharges) and FTB (Fast Transient burst) tests. For cost reasons, this number of supply pins tends to be...
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