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Fan-Out Wafer Level Packaging (FOWLP) is one of the latest trends in microelectronics packaging. FOWLP has a high potential in significant package miniaturization concerning package volume but also in thickness. Main advantages of FOWLP are the substrate-less package, low thermal resistance, high RF performance due to shorter interconnects together, as the direct IC connection by thin film metallization...
Polymers are widely used in microelectronics packaging as e.g. adhesives or encapsulants. Low cost and mass production capabilities are the main advantages of these materials. But like all polymers they cannot provide a hermetical sealing due to their permeability properties. The susceptibility to diffusion of liquids and gases through the polymer and along the interfaces is a drawback for polymers...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. For FOWLP known good bare dies are embedded into mold compound forming a reconfigured wafer. A thin film redistribution layer is applied on the reconfigured wafer routes the die pads to the space around the die on the mold compound (fan-out). After solder ball placement and package singulation by dicing...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. The technology offers not only solutions for single chip packaging but also approaches for 3D system integration or RF suitable packaging. Mold embedding for this technology is currently done on wafer level up to 12"/300 mm size. For higher productivity and therewith lower costs larger mold embedding...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12”/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer size of...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12"/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer diameter...
General lighting by use of LED-Chips is one of the strongly growing markets today and also in future. One of the trends goes to LEDs with higher and higher luminous fluxes per chip area to get the best price per lumen on the market. Unfortunately, such large LEDs produce a lot of heat, which must be spread to avoid overheating and shorter lifetime of the LEDs. Another approach is the use of many small...
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area.
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