The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as Ball Grid Array (BGA) with flipchip or wirebonding. With the advancement of various fan-out (FO) WLPs, it has been proven to be a more optimal, low cost, integrated and reliable solution compared to fan-in...
To meet the continued demand for form factor reduction and functional integration of electronic devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison with standard Ball Grid Array (BGA) packages. The advancement of fan-out WLP has made it a more promising solution as compared with fan-in WLP, because it can offer greater flexibility in enabling...
With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the advancement of various fan-out Wafer Level Packaging (FOWLP) designs, this advanced technology has proven to be a more optimal and promising solution compared to fan-in WLP because of the greater design flexibility...
When it comes to reducing form-factor and increasing functional integration of mobile devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the advancement of various fan-out WLP (FOWLP), it is a more optimal and promising solution compared to fan-in WLP because it can offer greater flexibility in...
The trends for smartphone and other mobile devices are more than ever for integration and lower cost. Meanwhile, a higher degree of functionality and performance, thinner profile, and longer battery life are some of the additional market drivers seen in these devices. The implications of these market drivers on the packaging content of mobile devices including internet of things (IoT) and wearable...
The number of WLCSP (Wafer Level Packages) used in semiconductor packaging has experienced significant growth since its introduction in 1998. The growth has been driven primarily by mobile consumer products because of the small form factor and high performance enabled in the package design. And it is also attractive to WE (wearable electronics) and IoT (Internet of Things) products. Although WLCSP...
The emergence and evolution of any package technology is driven by market trends as experienced by the end application. With the maturation of the mobile market, the trends for Smartphone and other mobile devices are more than ever for lower cost. Meanwhile, a higher degree of functionality and performance, thinner profile, and longer battery life are some of the additional market drivers seen in...
New and emerging applications in the consumer and mobile space, the growing impact of the Internet of Things (IoT) and wearable electronics (WE), and the slowdown of Moore's law have been driving many new trends and innovations in advanced packaging technology. The semiconductor industry now has to focus on integration and system scaling to meet the ever-increasing electronic system demands for performance...
The advancement of silicon scaling to 14/16 nanometer (nm) in support of higher performance, higher bandwidth and lower power consumption in portable and mobile devices is pushing the boundaries of emerging packaging technologies to smaller fan-out packaging designs with finer line/spacing as well as improved electrical performance and passive embedded technology capabilities. Advanced embedded Wafer...
The demand for Wafer Level Chip Scale Packages (WLCSP) has experienced tremendous growth due to the surge in demand for advanced mobile products. The increased demand is seen for both 200mm wafers and 300mm wafers, however a significant segment of the market continues to be driven by 200mm designs. The infrastructure capacity supporting 200mm WLCSP has been stressed as a result of the mature status...
The demand for Wafer Level Chip Scale Packages (WLCSP) has experienced tremendous growth due to the surge in demand for advanced mobile products and pressure of cost reduction. The increased demand is seen for both 200mm wafers and 300mm wafers, however a significant segment of the market continues to be driven by 200mm designs. The infrastructure capacity supporting 200mm WLCSP has been stressed...
The demand for Wafer Level Chip Scale Packages (WLCSP) has experienced tremendous growth due to the surge in demand for advanced mobile products. The increased demand is seen for both 200mm wafers and 300mm wafers, however a significant segment of the market continues to be driven by 200mm designs. The infrastructure capacity supporting 200mm WLCSP has been stressed as a result of the mature status...
Increasing demand for advanced electronic products with a smaller form factor, superior functionality and performance with a lower overall cost has driven semiconductor industry to develop more innovative and emerging advanced packaging technologies. Memory bandwidth has become a bottleneck to mobile processor performance and lower power consumption for high performance computing needs. To reduce...
This paper introduces a new encapsulated WLCSP product (eWLCS). The new product has a thin protective coating applied to all exposed silicon surfaces on the die. The applied coating protects the silicon and fragile dielectrics and prevents handling damage during dicing and assembly operations, effectively providing a durable packaged part in the form factor of a WLCSP. The manufacturing process leverages...
The market for portable and mobile data access devices connected to a virtual cloud access point is exploding and driving both increased functional convergence as well as increased packaging complexity and sophistication. This is driving an unprecedented demand to increase the variety of wafer level, thin POP (Package on Package), and TSV (Through Silicon Via)/Interposer packaging solutions. It is...
Currently various wafer level packaging (WLP) technologies are now cruising at a very high altitude, especially in mobile and portable applications. This is significant trend in packaging business: over 25 billion WLP units are expected to be mounted in smart-phones, tablet PCs or portable devices in 2012. Cost reduction together with miniaturization remains the main driver for adoption of WLP technology...
Current portable electronic products are driving component packaging towards 3D packaging technologies for integrating multiple memory die and application processors (AP). Among the 3D technologies, Package-on-Package (PoP) is increasingly becoming mainstream due to its flexibility of combination and sourcing. Moreover, device designs require functional integration of IC's, especially in the 3rd dimension,...
This paper presents the effect of back grinding on the mechanical properties of the active side of the multilayered low-k stacked die. Low-k stacked wafers were thinned to four different thicknesses of 500, 300, 150, and 75 by using a commercial grinding process. Nanoindentation and nanoscratch tests were performed on both the normal (no back grinding) and back grinded samples to analyze...
This paper will highlight some of the recent advancements in 300mm eWLB wafer development. Compared to 200mm case, 300mm eWLB wafer has more warpage and process issues due to its area increase. Thermo-mechanical simulation shows 100∼150% more warpage with 300mm eWLB wafer compared to 200mm. So various design parameters were studied to optimized warpage, such as dielectric materials and thickness,...
Increasing demand for new and more advanced electronic products with a smaller form factor, superior functionality and performance with a lower overall cost has driven semiconductor industry to develop more innovative and emerging advanced packaging technologies.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.