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To meet the continued demand for form factor reduction and functional integration of electronic devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison with standard Ball Grid Array (BGA) packages. The advancement of fan-out WLP has made it a more promising solution as compared with fan-in WLP, because it can offer greater flexibility in enabling...
When it comes to reducing form-factor and increasing functional integration of mobile devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the advancement of various fan-out WLP (FOWLP), it is a more optimal and promising solution compared to fan-in WLP because it can offer greater flexibility in...
Three dimensional finite element analysis (FEA) is performed to assess the board level temperature cycling reliability for lead-free solder Sn96.5Ag3Cu0.5 (SAC305) used in eWLB packages. With Anand viscoplastic constitutive model used for the solder material, the chosen damage parameters, i.e. accumulated creep strain or accumulated creep strain energy density, can be derived from the finite element...
Embedded Wafer-Level Ball Grid Array (eWLB) technology was developed to provide a wafer-level packaging solution for semiconductor devices requiring a higher integration level and a greater number of external contacts. Essentially, eWLB is a fan-out wafer-level packaging in which silicon die is embedded in the mold compound and the redistributed layer can be carried out over both silicon die and mold...
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