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With the improvement in integrated circuits features and increase in clock frequency, it becomes necessary to make a transition to an interconnect materials with better electrical performance. The implementation of low-k materials into the 90 nm and further technology nodes has been thwarted by the lack of viable packaging solutions. To-date no solution to enable true-low-k packaging exists. Low-k...
With the move to 300 mm wafer, WLP becomes even more attractive as the solution for backend processing. More importantly as an enabling technology for the most advanced 0.13 micron technology using Cu/low-k interconnect devices. Cu/low-k devices need WLP since wire-bond forces could damage the soft device structures. Additionally, low-k interconnect densities often reach values that can only be accommodated...
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