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The indentation modulus of thin films of porous organosilicate glass with a nominal porosity content of 30% and thicknesses of 350nm, 200nm, and 46nm is determined with help of atomic force acoustic microscopy (AFAM). This scanning probe microscopy based technique provides the highest possible depth resolution. The values of the indentation modulus obtained for the 350nm and 200nm thin films were...
In this study we demonstrate the sensing capabilities of a portable multiplex measurement system for FET-based (bio)chemical sensors with an integrated microfluidic interface. We therefore conducted pH measurements with Silicon Nanoribbon FET-based Sensors using different measurement procedures that are suitable for various applications. We have shown multiplexed measurements in aqueous medium for...
The paper presents experimental results on tin-based solder alloys to their mechanical visco-plastic deformation behaviour under systematically investigation of cooling rates and their micro-structural solidification.
Reported here is an experimental study and mechanical characterization of the annealing process of TSV structures. A major focus of this study is the extent of thermo-mechanical stresses, which form during this processing step. Results of bowing as well as copper protrusion measurements before and after the annealing process are presented as indicators for the stress development during the heating...
Here, we present an advanced experimental procedure for determining the properties of a SnAg3.5 solder alloy in the strain range of primary creep under cyclic load and isothermal conditions. The challenge in this experiment is the accurate high-resolution measurement of sample elongation used for a closed-loop control, as well as avoiding the influence of sensor and specimen clamping. We realized...
This paper will present the research results for reliability of two embedding technologies in comparison to the current standard - surface mount technology. The chosen embedding approaches utilize a cavity to place the necessary components into the PCB core. The difference is found in the way the component is connected to the PCB routing. For the first approach the circuit is first assembled on a...
Electronics for automotive or mobile applications are exposed to vibration and shock loads causing PCB and interposer vibration. This leads to high strain rates within the component solder joints. It is known that solder joints show strain rate dependent yield behaviour [1-4] as well as that the strain rate dependency is dependent on the solder alloy composition. The solder joint alloy composition...
The outlined investigations represent a new systematic approach for the characterization of the copper annealing behavior in TSVs. In the center of interest are the changes in material behavior caused by bath chemistry compositions and deposition parameters during the ECD copper fill. In addition the effects on annealing behavior with or without Cu overburden are evaluated. Therefore, two bath chemistries...
Power over fiber is an attractive alternative for powering remote sensors in electromagnetically sensitive environments. Compared to energy harvesting, it can deliver uninterrupted energy to sufficiently supply elaborate sensing, computation or even actuation along with a continuous communication requirement in distributed sensor networks, as for example in structural health monitoring. For the photonic...
A robust, high precision sensor interface (SI) for in-situ temperature measurements in process engineering is presented. Wiring and interference are minimized by directly connecting thick film technology based sensing elements (SEs) to the interface PCB. Fully digital calibration, operating temperature compensation and noise canceling are demonstrated. A low-noise supply scheme for a wide range of...
This work presents the research towards two promising embedding approaches for electronic components with a possible application to integrate a sensor node for structural health monitoring into the structure itself. The production process for both integration methods has been assessed through experimental and simulation effort. Samples with passive components for both presented approaches have been...
The aim of this study is the development of a portable measurement system that simplifies the analysis of bio-sensitive silicon nanowire field effect transistors (SiNW - FETs). In order to obtain the pH - dependent transfer characteristics of the Schottky barrier (SB) FETs, Id = f (Vg), a measurement unit and two biochip adapters are proposed. For the parallel measurement of multiple SiNW - FETs,...
The paper presents low cycle fatigue results and properties as measured by small solder joints in a shear test setup. These symmetrical triangle experiments were performed at 25 °C by the variation of the specimen's displacements and the solder joint materials. The displacements varied between 2 µm and 8 µm to get strains up to 2 % and stresses up to 40 MPa. The used solder ball alloys are SnAg3.5,...
Embedding of discrete passives or functional chips as bare dies has been successfully proven in the last years. The embedding technology provides multiple advantages when compared to conventional surface mount technology. As of today multiple possibilities to embed active devices in the substrate exist.
In this paper the thermo-mechanical behavior of Through Silicon Vias (TSVs) is in the center of interest. Therefore a Finite Element model was developed, which calculates emerging stresses and strains in TSV periphery during annealing. For validation of the simulation results μ-Raman measurements on according test samples were carried out. Samples underwent annealing at 250 °C for 2 h. Warpage and...
A novel non-destructive evaluation method of inductively excited lock-in thermography (called InduLIT in this paper) is investigated for crack detection on PCB-vias. Previous publications already showed the working principle. Now the crack inspection of PCB-vias using flat inductors is investigated in detail. FE-models were created to get a better understanding of the process and to find optimum excitation...
Power over fiber or photonic power is an attractive alternative for powering remote sensors in electromagnetically sensitive environments. Compared to energy harvesting, it can deliver uninterrupted energy in larger amounts (up to few hundreds of milliwatts) to enable more elaborate sensing, computation or even actuation along with continuous communication requirements. From the photonic packaging...
Herein we describe the annealing behavior of copper Through Silicon Vias (TSVs) in a series of experiments. Temperatures ranged from 150 °C to 450 °C and the dwell of the temperature varied between 30 min and 4 h. Copper protrusion, test samples warpage and the copper microstructure were examined in a subsequent characterization. Combining the results of these measurements enables the determination...
This work focuses on the mechanical behaviour of lead free solder alloys under high strain rate and thermal aging conditions. Tensile experiments have been accomplished using miniature specimens with a diameter of 1 mm to stay close to the dimensions of real solder joints. The specimens have been manufactured by a casting process. A controlled cool down process was applied having a cooling rate of...
The effects of plasma-treatment on the contact quality of the molybdenum back contact of flexible solar cells interconnected with isotropic conductive adhesives have been studied. The influence of the surface treatment on surface properties like roughness, contact angles and surface energies have been measured and flow characteristics have been analyzed. The contact resistances and microsections have...
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