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A side airbag sensor packaging directlly attached to the side frame (center pillar) of automobiles by adhesive is introduced in this study. To assess the feasibility for the packaging, a test instrument was manufactured to examine the impact sensibility by drop tests. The conventional sensor module with plastic housiung and the new sensor packaging were installed to aluminum channel, and the results...
Advanced More than Moore integrated circuit chip packaging is leading to the development of multiply stacked silicon die and these die are becoming ever thinner. This is leading to reliability problems. One of these is process induced die strain/warpage and there is no compelling metrology which can non-destructively measure the warpage of the die inside the packaged chips. In this paper we report...
The impact of solder-joint tilting on the reliability of high-power LEDs soldered on PCBs is investigated by means of FEM simulations correlated with thermal cycling experiments. A non-uniform solder joint stand-off height is implemented into the FEM and, using crack propagation modelling approach, the number of cycles to complete fracture are predicted.
This paper presents the packaging and residual stress effects on three-axis silicon-on-insulator (SOI) micro-electro-mechanical system (MEMS) accelerometer by using finite element method (FEM). The 3D FEM model was established and the resonance frequency was obtained by modal analysis method. This paper also developed a simple compensation model for trimming the offset of capacitance differentiation...
We present a new simple constitutive model for dielectric charging. The model is motivated by the functional form of the Frenkel-Poole conduction, but it enables to track the time evolution of charge distribution within the dielectric. The prediction of charge distribution is used to deduce the voltage buildup in the dielectric. Based on this model, we present a prediction of the current through a...
Large power semiconductors are complex structures, their metallization usually containing many thousands of contacts or vias. Because of this, detailed FEM simulations of the whole device are nowadays not possible because of excessive simulation time. This paper introduces a simulation approach which allows quick identification of critical regions with respect to lifetime by a simplified simulation...
Due to the effects of the Moore's law, the process variations in current technologies are increasing and have a major impact on power and performance which results in parametric yield loss. Due to this, process variability and the difficulty of modeling accurately transistor behavior impede the dimensions scaling benefits. The Fully Depleted Silicon-On-Insulator (FDSOI) technology is one of the main...
A high current load may cause the Joule heating, subsequently raising the chip temperature in a conventional power module. Temperature excursion in power chip may generate thermal stress, induce failure and reduce its reliability. Double-sided power module is a crucial structure to provide another heat dissipation path and efficiently reduce chip temperature. This study estimate the thermal and reliability...
For the first time, nested sub-modeling approach and Finite Element Analysis have been used to analyze the structural mechanical of 3D Printed part, whereas the details of 3D printing patterns included in sub-model. The results present a general tool which can improve the quality of 3D printed parts, which have multidisciplinary application in various fields. It is found that the Maximum Principle...
Large-scaled dye-sensitized solar cell (DSC) modules are recently developed for building-integrated photovoltaic (BIPV) applications. In the modules, two glasses with electrodes and dye are sealed together to prevent the leakage of liquid electrolyte. It is known that DSC modules deteriorate rapidly under high temperature conditions. Previous studies showed that expansion of liquid electrolyte in...
The method of laser marking die for the purpose tracking and identification is well established in the semiconductor industry. This process needs to be well controlled in order to avoid sacrificing the fracture strength of the die. A common way to assess and compare different laser marking processes is to conduct a series of fracture tests and calculate the characteristic strength that can be expected...
A high accelerated stress testing (HAST) system is introduced to study the photo-thermal stability and reliability of remote phosphor plates, made from Bisphenol-A polycarbonate (BPA-PC) and YAG. Remote phosphor plates, combined with a blue-light LED source, are used to produce white light with a correlated colour temperature (CCT) of 4000 K. In this study, the remotephosphor BPA-PC samples of 3 mm...
In a highly competitive and demanding microelectronics market, reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded. Any robust non-destructive method should be capable of dealing with the complexity of miniaturized assemblies such as chip-scale packages and 3D IC stacks. Scanning acoustic microscopy (SAM) is indeed one the best non-destructive...
In this work we present the results on a reliability study on SMD components mounted on an organic power electronics substrate. The substrate technology has been developed to meet the needs of high ampacity and thermal conductivity with an organic substrate material. Therefore a thick structured copper core was introduced throughout the entire substrate size (see fig. 1). On top of the copper core...
Numerous applications require tactile interfaces today. In particular, many customers' applications such as Smartphone, tablet PC or touch pad can be concerned by high performances, low voltage haptic interfaces which allow the user to interact with its environment by the sense of touch. This technology is already used but with limitations such as high power consumption and limited feedback effect...
The failure of aluminum electrolytic capacitors is considered as one of major failure modes of the LED drivers. This paper propose a degradation model of aluminum electrolytic capacitors considers impacts of operation time and temperature.
This paper presents a fast design strategy for Poly-SiGe MEMS pressure sensors, based on circular Kirchhoff-Love plate theory. The underlying analytical model allows for a rapid and accurate evaluation of the sensitivity of the sensors, crucial for improving their design. The accuracy of the new model is demonstrated by comparing its predictions with more computationally expensive simulation techniques...
Stretchable electronics system is an emerging technology for next-generation electronics. These type of stretchable system can geometrically accommodate large mechanical deformations without imparting significant strains and stress in the materials themselves. Potential uses include flexible sensors, transmitters and new photovoltaic and medical devices. Computational mechanics studies reveal many...
This article deals with the models development and FE simulations for mechanical properties of all-metal AFM-TERS tips and electric field enhancement between the tip and the sample. The most important aspects in simulations, the parameters necessary in creating models, and the obtained results are presented and discussed in the article.
Per today, commercial claims for LED-based products in terms of lumen maintenance are fully based on TM-21 extrapolations using LM80 data. There may be a risk in doing this as TM-21 only relies on the behavior of the average LED degradation, instead of taking into account the degradation of all individual LEDs. A more profound statistical analysis is required to make the step from TM-21 extrapolation...
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