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The continuous progress in miniaturization and integration of semiconductor devices have led to increasing heat generated from unit volume in the chip. Consequently, more efficient thermal management on chip and package level is required because the reliability of electronic equipment strongly decreasing with rising the temperature of work. To improve the heat dissipation from chip to package as well...
Temperature cycling of electronic components was carried out at two different temperature profiles, the first ranging between -55degC and 100degC (TC1) and the second between 0degC and 100degC (TC2). Totally, 7000 cycles were run at TC1 and 14500cycles at TC2. The test board's top-side components were surface mounted using Sn-3.8Ag-0.7Cu solder alloy, and the bottom side surface mount devices (SMD)...
The present work was mainly focused on the evolution of interfacial intermetallic compounds (IMCs) between solder and Au/Ni/Cu metallization in PBGA Sn-Ag-Cu solder balls during thermal cycling test. The PBGA package was assembled on the FR-4 board using a typical surface mounting assembly process, and the thermal cycling was carried out in a systematic manner for two different temperature cycling...
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