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In this paper, a leading indicators based approach has been developed for prognostics and health monitoring of electronic systems. The approach focuses on the prefailure space and methodologies for quantification of damage progression and residual life in electronic equipment subjected to shock and vibration loads using the dynamic response of the electronic equipment. Traditional health monitoring...
Connector fretting propensity is generally evaluated through an exhaustive series of experimental tests, making the connector design and validation process time consuming and costly. Thus, a method using modeling and simulation techniques to predict the influence of various design factors on vibration-induced fretting propensity in electrical connectors would be very beneficial to those responsible...
Aerospace-electronic systems usually face a very harsh environment, requiring them to survive the high strain rates, e.g. during launch and re-entry and thermal environments including extreme low and high temperatures. Traditional health monitoring methodologies have relied on reactive methods of failure detection often providing little or no insight into the remaining useful life of the system. In...
Vibration-induced fretting can be a major problem for connector systems used in vehicle electronics. However, at present much of the evaluation of fretting propensity for particular connector designs and the influence of variations in those designs on fretting performance is conducted through exhaustive experimental testing. A simulation-based method would be of great value to those responsible for...
A new approach based on auto-regressive and time- frequency analysis has been developed to monitor system- level damage in implantable biological electronic systems such as pacemakers and defibrillators. The approach focuses is on the pre-failure space and methodologies for quantification of failure in implantable biological electronics subjected to shock and vibration loads using the dynamic response...
Requirements for system availability for ultra-high reliability electronic systems such as airborne and space electronic systems are driving the need for advanced heath monitoring techniques for early detection of the onset of damage. Aerospace-electronic systems usually face a very harsh environment, requiring them to survive the high strain rates, e.g. during launch and re-entry and thermal environments...
Electrical contacts may be subjected to wear because of shock, vibration, and thermo-mechanical stresses resulting in fretting, increase in contact resistance, and eventual failure over the lifetime of the product. Previously, models have been constructed for various applications to simulate wear for dry unidirectional-sliding wear of a square-pin [1], unidirectional sliding of pin on disk [2], and...
In this paper, principal component regression models (PCR) have been investigated for reliability prediction and part selection of area package architectures under thermo- mechanical loads in conjunction with stepwise regression methods. Package architectures studied include, BGA packages mounted on CU-CORE and NO-CORE printed circuit assemblies in harsh environments. The models have been developed...
A wavelet-packet energy decomposition, and time frequency analysis based approach has been developed to monitor system-level damage in implantable biological electronic systems such as pacemakers and defibrillators. The approach focuses is on the pre-failure space and methodologies for quantification of failure in electronic equipment. Presented methodologies are applicable at the system-level for...
In this paper, a mathematical approach for interrogation of system state under cyclic thermo-mechanical stresses has been developed for 6-different leadfree solder alloy systems. Data has been collected for leading indicators of failure for alloy systems including, SnlAg0.5Cu, Sn3Ag0.5Cu, Sn4Ag0.5Cu second-level interconnects under the application of cyclic thermo-mechanical loads. Methodology presented...
In this paper, a design-envelope approach based on optical feature extraction techniques has been investigated for drop and shock survivability of electronic packaging has been presented for 6-leadfree solder alloy systems. Solder alloy systems investigated include, Sn1Ag0.5Cu, Sn3Ag0.5Cu, Sn0.3Ag0.7Cu, Sn0.3Ag0.7Cu0.1Bi, Sn0.2Ag0.7Cu0.1Bi- 0.1Ni, 96.5Sn3.5Ag. Previously, digital image correlation...
In this paper, the accuracy of optical measurements based on digital image correlation (DIC) with ultra high-speed imaging has been investigated for full-field measurement of transient strain in various board assemblies subjected to shock in various orientations. Previous researchers have measured the transient-dynamics of board assemblies with high-speed imaging in conjunction with high-speed image...
In this paper, a mathematical approach for interrogation of system state under cyclic thermomechanical stresses has been developed for three-different leadfree solder alloy systems. Data has been collected for leading indicators of failure for alloy systems including, Sn1Ag0.5Cu, Sn3Ag0.5Cu, Sn4Ag0.5Cu second-level interconnects under the application of cyclic thermo-mechanical loads. Methodology...
In this paper, the feature extraction for health monitoring based on optical measurements of transient-strain from digital image correlation (DIC) in conjunction with ultra high-speed imaging has been investigated. Full-field measurement of transient strain have been made in various board assemblies subjected to shock in various orientations. Feature-extraction for health monitoring of leadfree area...
Connector fretting propensity is generally evaluated through an exhaustive series of experimental tests, making the connector design and validation process time consuming and costly. Thus, a method using modeling and simulation techniques to predict the influence of various design factors on vibration-induced fretting propensity in electrical connectors method would very beneficial to those responsible...
Electronics may be subjected to shock, vibration, and drop-impact during shipping, handling and during normal usage. Measurement of transient dynamic deformation of the electronics assemblies during the shock and vibration can yield significant insights in understanding the occurrence of failure modes and the development of failure envelopes. Failure-modes include solder-joint failures, pad cratering,...
Methodologies for prognostication and health monitoring can significantly impact electronic reliability for applications in which even minimal risk of failure may be unbearable. Prognostics health-monitoring (PHM) approach presented in this paper is different from state-of-art diagnostics and resides in the pre-failure-space of the electronic-system, in which no macro-indicators such as cracks or...
The built-in stress test (BIST) is extensively used for diagnostics or identification of failure. The current version of BIST approach is focused on reactive failure detection and provides limited insight into reliability and residual life. A new approach has been developed to monitor product-level damage during shock and vibration. The approach focuses is on the pre-failure space and methodologies...
In this paper, damage pre-cursors based residual life computation approach for various package elements to prognosticate electronic systems prior to appearance of any macro-indicators of damage has been presented. In order to implement the system-health monitoring system, precursor variables or leading indicators-of-failure have been identified for various package elements and failure mechanisms....
Damage pre-cursors based health management and prognostication methodology has been presented for electronic systems in harsh environments. The framework has been developed based on a development of correlation between damage pre-cursors and underlying degradation mechanisms in lead-free packaging architectures. The proposed methodology eliminates the need for knowledge of prior stress histories and...
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