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In this paper, principal component regression models (PCR) have been investigated for reliability prediction and part selection of area package architectures under thermo- mechanical loads in conjunction with stepwise regression methods. Package architectures studied include, BGA packages mounted on CU-CORE and NO-CORE printed circuit assemblies in harsh environments. The models have been developed...
Damage pre-cursors based health management and prognostication methodology has been presented for electronic systems in harsh environments. The framework has been developed based on a development of correlation between damage pre-cursors and underlying degradation mechanisms in lead-free packaging architectures. The proposed methodology eliminates the need for knowledge of prior stress histories and...
There is a fundamental need for development of predictive techniques for electronic failure mechanisms in shock and drop-impact. Presently, one of the primary methodologies for assessment of shock and vibration survivability of electronic packaging is the JEDEC drop test method, JESD22-B111 which tests board-level reliability of packaging. However, packages in electronic products may be subjected...
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