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Wafer Level Chip Scale Packaging (WLCSP) varies in die size — length, width and height. It also have different number bumps per package which depends on the functionality of the device. Conventional way of doing failure analysis on WLCSP was very challenging from handling the unit and up to doing fault isolation, typically this results to a long cycle time in analyzing it. This paper aims to develop...
There is a recent influx of failures on an automotive device particularly on a Monolithic Step-Up DC-DC Converter. Difficulty arises on the defect localization of the metal stringer since majority of the failing units have different electrical signatures wherein some returned units are failing at field, 0Km failure or failing at higher temperature which was either verified electrically failing at...
There are recent failures on a Low Dropout (LDO) Regulator where the customer is experiencing an out of specification output voltage. This paper aims to investigate the exact root cause of the failure by detailed failure analysis and relating the customer complaint to the die crack observed.
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