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There is a recent influx of failures on an automotive device particularly on a Monolithic Step-Up DC-DC Converter. Difficulty arises on the defect localization of the metal stringer since majority of the failing units have different electrical signatures wherein some returned units are failing at field, 0Km failure or failing at higher temperature which was either verified electrically failing at...
Some of the wafer fabrication defects are unable to be screened out during final test. It is inevitable that these defective units will reach customer. This paper aims to discuss on the failure analysis approach and resolution of wafer fabrication defect, missing silicide layer.
There are recent failures on a Low Dropout (LDO) Regulator where the customer is experiencing an out of specification output voltage. This paper aims to investigate the exact root cause of the failure by detailed failure analysis and relating the customer complaint to the die crack observed.