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In the big data era, a new computing system, called Cognitive Computing, that can handle unstructured data, learn and extract the insights is required. A neuromorphic device is a key component for this, and several architectures are reported. Compared to the neuromorphic device with SRAM-based spiking neural network, a cross-bar structure device realizes on-chip leaning, but requires high-density...
In the big data era, a new computing system, called Cognitive Computing, that can handle unstructured data, learn and extract the insights is required. A neuromorphic device is a key component for this, and several architectures are reported. Compared to the neuromorphic device with SRAM-based spiking neural network, a cross-bar structure device realizes on-chip leaning, but requires high-density...
Assembly process reliability for Optical Multi-Chip Modules (MCM) is studied and improved. In the optoelectronic (OE) chip assembly for the Optical MCM, the OE chip with Au stud bump is joined with Sn-Ag-Cu (SAC) soldered in a through-waveguide via on an organic substrate to obtain high optical coupling efficiency. Since solid-liquid diffusion of Au to molten SAC is rapid, and formation of brittle...
In this study, we investigated effects of thermal gradient of joint during flip chip bonding on intermetallic compound (IMC) growth for several solder materials. Cu/Sn-2.5Ag/Cu joint was prepared by bonding electroplated Cu/Sn-2.5Ag bump on Cu pad. Ni/Sn/Ni, Ni/In/Ni, Ni/In-48Sn/Ni, and Ni/Sn-58Bi/Ni joints were prepared by solder capping by IMS on electro-less plated Ni/Au post and bonding it on...
Fine pitch interconnect is one of key technology elements for 2.5D and 3D IC. Low cost and flexibility in technical aspects are also important, so that the technology can be used for wide range of applications. We have newly developed a non-strip type photosensitive resin and propose a novel IMS bumping process with it for finer pitch flip chip joining in a further cost-effective way. The photosensitive...
Injection Molded Solder (IMS) is an advanced solder bumping technology that the solder bumps can be made by injected pure molten solder through the masks. In this study, we investigated effects of solder wettability of resist mask on solder filling performance by solder flow simulation with computational fluid dynamics (CFD) software and experiments with IMS technology. It was confirmed by the simulation...
Novel bumping technology that can realize high density assembly of IC chips and packages with a high number of I/O is required in the field of electronic packaging. Currently, the electroplating method or the solder ball placement method have been widely adopted for the fabrication of solder bumps down to sub-hundred microns in diameter. However, there are some limitations with these current bumping...
2.5D packages that utilize an interposer capable of fine patterning are gaining prominence for applications that require high data transmission rate, wide I/O bus, and higher integration of functionality. There are various interposer materials proposed such as silicon, glass, and organic. Silicon has high thermal conductivity compared to glass and organic. The authors studied thermal performance of...
Lead-free solders such as SnAg or SnAgCu is widely used for flip chip joining. As a result of higher melting temperature and higher elastic modulus of the lead-free solders compared to eutectic SnPb solder, defect of crack or damage in low-k dielectric layers under bond pad for flip chip joining in the semiconductor chip became a serious issue. The crack or damage is caused by mismatch of coefficient...
Mechanical integrity of back end of line structures underneath wirebond pads was evaluated using 32 nm ultra low-k device by wire pull testing and 3D finite element analysis. Pad tearout rate at wire pull testing was measured for various Cu line/via structures. One key factor for robust bond pads is effective modulus in ULK levels. In addition, increased via and wiring metal density reduces the risk...
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