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Despite being originally inspired by the central nervous system, artificial neural networks have diverged from their biological archetypes as they have been remodeled to fit, particular tasks. In this paper, we review several possibilites to reverse map these architectures to biologically more realistic spiking networks with the aim of emulating them on fast, low-power neuromorphic hardware. Since...
This paper is focused on the thermally-induced thermo-mechanical load in interconnections of electronic products, which are necessary to connect an electronic component on substrate material (such as Printed Circuit Board). In order to improve of the material selection, the Fraunhofer IKTS has developed a measurement setup enabling a cost-efficient material characterization in terms of mechanical...
The paper presents details about the adequate experimental determination of the Young's modulus on miniaturized specimens for material used in electronic packaging. The difficulty to determine accurately the Young's modulus is caused by the requirements of representative specimens for the area of electronic packaging. In many cases such specimens, e.g. solder balls, are connected with the issues of...
Since more than two years, the First G-APD Cherenkov Telescope (FACT) is operating successfully at the Canary Island of La Palma. Apart from its purpose to serve as a monitoring facility for the brightest TeV blazars, it was built as a major step to establish solid state photon counters as detectors in Cherenkov astronomy.
Here, we present an advanced experimental procedure for determining the properties of a SnAg3.5 solder alloy in the strain range of primary creep under cyclic load and isothermal conditions. The challenge in this experiment is the accurate high-resolution measurement of sample elongation used for a closed-loop control, as well as avoiding the influence of sensor and specimen clamping. We realized...
Saving energy in buildings is often hampered by the lack of detailed information about what is using the energy, how much it is using, and how to automatically and remotely control devices. The problem is especially acute for the large number of small, energy-using devices that are present in both residential and commercial buildings. Most of these products use a switching ac to dc power supply to...
To optimize intensity-localization in spatio-temporally focused ultrafast beams we demonstrate spectral interferometric and spectrally-resolved knife edge scan methods to characterize lateral and angular spatial chirp. A novel dispersion scan yields the focused-pulse spectral phase.
Electronics for automotive or mobile applications are exposed to vibration and shock loads causing PCB and interposer vibration. This leads to high strain rates within the component solder joints. It is known that solder joints show strain rate dependent yield behaviour [1-4] as well as that the strain rate dependency is dependent on the solder alloy composition. The solder joint alloy composition...
Since two years, the FACT telescope is operating on the Canary Island of La Palma. Apart from its purpose to serve as a monitoring facility for the brightest TeV blazars, it was built as a major step to establish solid state photon counters as detectors in Cherenkov astronomy. The camera of the First G-APD Cherenkov Telesope comprises 1440 Geiger-mode avalanche photo diodes (G-APD), equipped with...
Embedding of discrete passives or functional chips as bare dies has been successfully proven in the last years. The embedding technology provides multiple advantages when compared to conventional surface mount technology. As of today multiple possibilities to embed active devices in the substrate exist.
A novel non-destructive evaluation method of inductively excited lock-in thermography (called InduLIT in this paper) is investigated for crack detection on PCB-vias. Previous publications already showed the working principle. Now the crack inspection of PCB-vias using flat inductors is investigated in detail. FE-models were created to get a better understanding of the process and to find optimum excitation...
This work focuses on the mechanical behaviour of lead free solder alloys under high strain rate and thermal aging conditions. Tensile experiments have been accomplished using miniature specimens with a diameter of 1 mm to stay close to the dimensions of real solder joints. The specimens have been manufactured by a casting process. A controlled cool down process was applied having a cooling rate of...
This paper focuses on the characterization and Finite Element (FE) simulation of thermo-mechanical loads in Through Silicon Vias (TSVs), which emerge due to the annealing process after electro chemical deposition (ECD) of copper. For this purpose a FE-model has been implemented, which calculates the stress state of TSV structures after annealing. To validate the model, measurements using μ-Raman spectroscopy...
In this work the life time of solder joints of SMD components is studied under vibration loading. This kind of purely mechanical load is one of the main failure causes in automotive electronics. A test vehicle has been designed to enable vibration testing on SMD capacitors (size 0805). The test vehicle is distinguished with a line clamping and stripe shape which both leads to a concerted loading of...
We interfere an amplified output pulse with a copy that has been converted using third-order cross-polarized wave generation. The ASE pedestal shows as a background in the interference, yielding the short-pulse/ASE energy contrast.
3D packaging is one of the main emerging markets especially for mobile application within the last view years. Mobile devices are exposed and hence need to be reliable under to vibration or mechanical shock conditions. Therefore, material properties covering strain rate dependency have to be at hand within reliability studies. Miniature bulk specimens were utilized to gain stress and strain data at...
Using a setup for high strain rate tensile experiments the mechanical behaviour of two SAC solders is investigated. The first alloy is SnAg1.3Cu0.5Ni. The second alloy has a higher silver content but no addition of Ni. Solder joints are the main electrical, thermal and mechanical interconnection technology on the first and second interconnection level. With the recent rise of 3D packaging technologies...
In this paper we describe our approach towards highly configurable neuromorphic hardware systems that serve as useful and flexible tools in modeling neuroscience. We utilize a mixed-signal VLSI model that implements a massively accelerated network of spiking neurons, and we describe a novel methodological framework that allows to exploit both the speed and the programmability of this device for the...
We will set up a fully functional system consisting of a custom design hardware framework (Figures 1 and 2) with the neural network chips described in the appended 4-page paper, Section II-A. The framework is connected digitally to a host PC, on which we will run a software that provides the simulator-like, flexible and non-expert usability of the neuromorphic device as described in the appended paper,...
Modeling neural tissue is an important tool to investigate biological neural networks. Until recently, most of this modeling has been done using numerical methods. In the European research project "FACETS" this computational approach is complemented by different kinds of neuromorphic systems. A special emphasis lies in the usability of these systems for neuroscience. To accomplish this goal...
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