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Wire bond interconnection still remains to be one of the most important fields of study in IC packaging development. The robustness of the interconnection between the bond wire and the bond pad are highly dependent on several key factors, mainly: 1) bond pad design, 2) capillary design, and 3) wire bond profile. Consequently, these factors also affect the package quality and reliability. Destructive...
In wire bond process, wire bond recipe is predefined to wire bonder before the start of wire bonding. This wire bond recipe comprises of single step to multi steps bond force and ultrasonic control depending on type of wire material and bond pad technology to use in wire bonding program [1]. The program always start with wire bondability assessment by manipulate different bond force, ultrasonic power...
This report discloses an advanced approach to improve the prediction of electronic IC packages' reliability performance by studying packaging materials' thermo-mechanical properties at different high temperature storage conditions. Package level reliability has been well studied. However, during material screening stage, it is difficult to estimate the impact of IC packaging materials on package reliability...
In a flip chip package (FCBGA), the presence of stress arising from the thermal mismatch between different materials is inevitable. It is a challenge for the packaging community to manage these stresses via careful selection of materials and design to achieve optimal performance and reliability of the integrated circuit. Finite Element Analysis (FEA) modeling for thermomechanical study is a widely...
In this work, a new empirical method is proposed to incorporate the initial substrate warpage into package stress simulation. As a first step, the bare substrate strip warpage characteristics were mapped. The out-of-plane displacements of the substrate strips were measured as a function of temperature using shadow moire technique. It was observed that the warpage values of the bare substrate vary...
Exposed pad packages were first introduced for their superior electrical and thermal performance. Some of the exposed pad packages do include a separate ground ring structure that is situated between the die pad and inner end of the leads. The ground ring is directly connected to the exposed pad. Multiple ground wires can then be bonded on the ground rings without the need to increase the pin count...
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