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In a flip chip package (FCBGA), the presence of stress arising from the thermal mismatch between different materials is inevitable. It is a challenge for the packaging community to manage these stresses via careful selection of materials and design to achieve optimal performance and reliability of the integrated circuit. Finite Element Analysis (FEA) modeling for thermomechanical study is a widely...
In this work, a new empirical method is proposed to incorporate the initial substrate warpage into package stress simulation. As a first step, the bare substrate strip warpage characteristics were mapped. The out-of-plane displacements of the substrate strips were measured as a function of temperature using shadow moire technique. It was observed that the warpage values of the bare substrate vary...
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