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Virtual metrology (VM) predicts on-wafer properties, such as thickness and uniformity, using equipment data (e.g., sensors, constants) and potentially on-wafer properties or predictions from previous steps. While much literature is devoted to developing VM models, maintaining them (e.g., so they can be used for months in production) presents a different set of challenges. Behavior of equipment can...
Advanced process control (APC), which includes run-to-run (R2R) process control and fault detection and classification (FDC) is pervasive in fabs today. While APC provides many benefits, it also presents many implementation and operational challenges including significant up-front configuration cost, lack of solution accuracy resulting in false/missed alarms, and lack of a consistent capability for...
Over the past two years the Predictive Maintenance (PdM) capability in semiconductor manufacturing has migrated from Proof-of-Concept (PoC) and univariate Fault Detection (FD) extrapolation mechanisms to fab-wide solutions that are (1) robust to typical process and equipment disturbances, (2) extensible so as to provide solution approaches that are portable across instances of a tool type and across...
Matching tools running identical processes is particularly critical for users migrating to more advanced nodes. Sustaining a fleet of tools to a matched state can reduce yield losses and yield variability, allow for greater routing flexibility in the fab, identify and control process inefficiencies, and reduce time for root cause analysis of yield issues. The matching process is multi-dimensional,...
Predictive maintenance (PdM) is cited by the ITRS as a critical technology to incorporate into production over the next five years to reduce unscheduled downtime and cycle time, maintain high quality, and reduce cost. Equipment Health monitoring (EHM) is a companion to PdM that provides a tracking indication of equipment health. The industry needs to deploy and assess PdM and EHM capabilities to determine...
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