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This paper presents a new carrierless approach to handling and processing ultra-thin Silicon which is predominantly used in processing Through Silicon Via (TSV) wafers. Currently, the state of the art consists of bonding the wafers having the vias onto a carrier wafer, after which the thinning steps of the wafer and the backside processing, e.g. Redistribution (RDL) or Bumping, are performed. By means...
The wafer level packaging for optical image sensor devices developed by Schott Advanced Packaging utilizes a through silicon via (TSV) by contacting the bond pads of the image sensors from the backside. Direct contact of the bond pads from the back side of the chip offers much shorter transmission paths to the board assemblies, thus providing faster signal speed, lower ohmic contact, efficient thermal...
The optical wafer level packaging, developed by Schott Advanced Packaging, consists of a Silicon wafer, comprising the optical sensors, which is bonded to a glass wafer in the very first process step to protect the sensors. The package utilizes a via through contact through the Silicon by contacting the bond pads of the image sensor from the backside. By this approach, a package for optical sensors...
The wafer level packaging for optical image sensor devices developed by Schott Advanced Packaging utilizes a via trough contact through the silicon by contacting the bond pads of the image sensors from the backside. Direct contact of the bond pads from the back side of the chip offers much shorter transmission paths to the board assemblies, thus providing faster signal speed, efficient thermal conduction...
Wafer level package for optical image sensor devices are known to be processed by re-routing of the bond pads to the back side of the chip, through (T) contacts located at the die edges. Bond pad back via contact wafer level packaging technology has been developed by Schott Electronic Packaging GmbH, Germany, which is proven to be with a number of advantages over the mechanically processed (T) contact...
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