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The development of automotive electronics (AE) towards autonomous driving applications generates various challenges, in particular also on the reliable functionality. In various cases dedicated automotive grade components are lacking and consumer components have to be used instead, which hardly fulfil automotive standards. Some of the reliability challenges are therefore thermo-mechanical in nature...
In More-than-Moore technologies, the number and complexity of micro and nano devices, that are directly integrated into control units of power electronics and mechatronics systems, increase. These systems typically operate at working voltages in the range of 220–1000 VRMS [1].
Increasing demands for higher energy efficiency and operating at harsh environments lead to the development of new compact power electronics, which is complemented by new interconnection technologies. Investigations were made on a planar copper interconnection technology. The characteristic difference to other technologies can be seen in the replacement of bonding wires by planar copper interconnects...
In contrast to the use of lead free solders in most electronic applications, replacement of high-lead materials has not yet been possible for die attach in power electronics. Accordingly, there is still some need for creep data input in related simulations. Several creep models of high-lead soft solder die attach materials were published, which were extracted from macro-scale material samples. However,...
Because of the need for electronics use at temperatures beyond 150°C, new high temperature interconnection technologies emerge, like silver sintering and copper wire bonding. In the project PROPOWER inverter modules with IGBTs and diodes mounted on DBC substrates were investigated as a prototype. Analyses were made to study the effects of the new interconnect technologies on fatigue failure. It is...
New demands on the thermo-mechanical design of sintered silver interconnections emerge. Development of this inter-connection technology and both experimental and theoretical studies on their reliability were subjects of the project “PROPOWER”. The focus of this paper is on theoretical analysis of thermo-mechanical reliability risks of a project demonstrator, an insulated-gate bipolar transistor (IGBT)...
For high temperature interconnection sintered silver can be used, however, it induces new demands on the thermo-mechanical design. That issue requires knowledge on the thermo-mechanical reliability of silver sintered devices, the subject of this paper. Material characteristics of the sinter layers are needed for simulation, which are addressed in the first part of the paper. Based on material properties...
Last decades in reliability prototyping of microelectronic devices show that from a long time there is no good solution to examine it in relatively short time and small expenditure of costs. Currently all thermo-mechanical reliability processes are long-lasting and costly. With using only the most dominating failure mode and cyclic loadings tests can last for a number of months. Companies, which produce...
New high temperature interconnection technologies emerge because of the need for electronics use at temperatures beyond 150 °C. Transient liquid phase (TLP) soldering is one option with the advantage of processing conditions being close to those for conventional soldering. In the Cu-Sn system addressed in the paper, a high post-processed melting point of the solder interconnects is achieved due to...
3D-integration becomes more and more an important issue for advanced LED packaging solutions as it is a great challenge for the thermo-mechanical reliability to remove heat from LEDs to the environment by heat spreading or specialized cooling technologies. Thermal copper-TSVs provide an elegant solution to effectively transfer heat from LED to the heat spreading structures on the backside of a substrate...
Simple adhesion tests like the pull-out test or the button shear tests have been used in industry for decades. They offer a great potential for comparison of different molding compounds, encapsulants, or adhesives on different types of substrates with or without surface treatment. However, for theoretical prediction purposes, interface fracture mechanics parameters are needed. Quantitative evaluations...
Ensuring reliability of interfaces of dissimilar materials is one of the most critical design aspects of electronic assemblies. A study on the interface delamination phenomenon of different power packages was undertaken. Thermally induced stresses caused by the thermal mismatch between molding compound (MC), Si-die, and Cu- heatsink act as combined shear and normal loadings on the respective interfaces...
Simple adhesion tests like the pull-out test or the button shear tests have been used in industry for decades. They offer a great potential for comparison of different molding compounds, encapsulants, or adhesives on different types of sub-strates with or without surface treatment. However, for theoretical prediction purposes, interface fracture mechanics parameters are needed. Quantitative evaluations...
Robustness of a package is often proven by performing temperature cycling tests. Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature variations remains a major concern for the reliability of semiconductor components. This issue is usually addressed by exposing the component to a certain number of cycles, followed by e.g. scanning acoustic microscopy...
Metal degradation has recently received increased attention as a failure mechanism in power devices under active cycling conditions, i.e. under repeated pulsed voltage/current loads. Both electro-thermal and thermo-mechanical simulation are indispensable for understanding this mechanisms. The paper presents experimental and simulation data for a dedicated test structure. A suitable lifetime model...
As a consequence of increasing functional density and miniaturization in microelectronics new low-k and ultra-low-k materials are going to be increasingly used in Back-end of line (BEoL) layers of advanced CMOS technologies. These ongoing trends together with the transition to the use of TSVs for 3D-IC-integration cause novel challenges for reliability analysis and prediction of relevant electronics...
High temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesion to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing delamination. Also during normal operation of electronic components heat is generated locally (bond wire or chip surface) degrading the moulding compound and reducing the adhesion which in...
Thermal cycling induced failure in power packages has been studied comparing thermal cycling (TC) with thermal shock (TS) tests by thermo-mechanical analyses. The major question for the time reduction is that after the failure mechanism and if it changes with changed loading type and duration. These questions were addressed by theoretical analyses including coupled transient thermal-mechanical analyses...
Lead-free reflow soldering techniques applying AuSn as well as SnAg electroplated bumps were chosen for the evaluation of the flip-chip-bonding process for X-ray pixel detectors. Both solders can be used in pick-and-place processes with a subsequent batch reflow suitable for high-volume production. AuSn solder was selected because of its fluxless bondability, good wettability, and self-alignment process...
High-speed wavelength modulation is demonstrated in a standard middle-infrared quantum cascade laser by near-infrared optical excitation. The typical wavelength modulation spectrum is obtained, which is observed at frequency up to 1.6 GHz.
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