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To reduce manufacturing cost, lead time, and process complexity, an embedded-active approach that targets rapid prototyping and low-volume production in micro-system packaging is being developed. The approach involves a rapid prototyping of micro-system packaging by a data-driven chip-first packaging process using direct printing of nano-particle metals. In the chip-first process, bare dice are first...
Rapid package prototyping (RPP) technology based on a data-driven chip-first approach using nano-particle silver (NPS) interconnects has been developed to promptly assess novel package designs, new packaging materials, and performance of new devices. A potential limitation of rapid package prototyping with NPS interconnects is the adhesion between NPS and polymer substrates such as LCP, Polyimide,...
Silver nano particle materials are investigated for use in microelectronics packaging as an innovative lead-free interconnect material. The nano particle materials were evaluated in terms of mechanical, electrical, metallurgical, and reliability performance. The silver nano particles are around 8nm in diameter and are sintered at a temperature of 230C to form material nearly indistinguishable from...
To reduce manufacturing cost, lead time, process complexity, and enhance electrical and mechanical reliability performance, an embedded-active approach that targets rapid prototyping and low-volume production in micro-system packaging is being developed. The approach involves a rapid prototyping of micro-system packaging by a data-driven chip-first packaging process using direct printing of nano-particle...
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