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We present a CMOS image sensor (CIS) with phase detection auto-focus (PDAF) in all pixels. The size of photodiode (PD) is 0.64μm by 1.28μm, the smallest ever reported and two PDs compose a single pixel. Inter PD isolation was fabricated by deep trench isolation (DTI) process in order to obtain an accurate AF performance. The layout and depth of DTI was optimized in order to eliminate side effects...
As pixel size of image sensors shrinks down rapidly, we are reaching technical barrier to get the required low light performance. In this paper, recent advanced technologies such as backside illumination, new color filter array, low F-number with extended depth of field technologies, etc. are introduced to overcome such a barrier. It is shown that the integration of these advanced sensor technologies...
A 1.4 μm-pitch pixel of CMOS image sensor, which is the smallest to date, has been successfully developed and integrated into 8M density for the first time. To overcome the crucial degradation of the saturation charge and sensitivity, a novel photodiode structure extended under transfer gate and an elaborate optical design including very thin tungsten pixel routing with 65 nm-grade design rules are...
Plasma doping (PLAD) was applied to reduce the dark current of CMOS image sensor (CIS), for the first time. PLAD was employed around shallow trench isolation (STI) to screen the defective sidewalls and edges of STI from the depletion region of photodiode. This technique can provide not only shallow but also conformal doping around the STI, making it a suitable doping technique for pinning purposes...
Technology and characteristics of 8-mega density CMOS image sensor (CIS) with unit pixel size of 1.75times1.75mum2 are introduced. With recessed transfer gate (RTG) structure and other sophisticated process/device technology, remarkably enhanced saturation capacity and ultra-low dark current have been obtained, which satisfy the requirements of high density digital still camera (DSC) application
ZnO or AlxGa1-xN charge trap device showed large memory window (>7V) with fast P/E speed (plusmn17 V, 100 (_is) and excellent retention (10-year memory window of 6 V with small charge loss rate; ~l/5 of that of Si3N4). GaN and ZnO trap devices also showed the photo-sensitive programming due to their optoelectronics properties, providing the possibility of developing new type of high performance...
CMOS image sensor (CIS) of 5-mega pixel density has been successfully developed with the smallest pixels (1.7mumtimes1.7mum) ever made. The newly introduced unique pixel architecture brought excellent optical symmetry and high electron capacity. Degradation of sensitivity and cross-talk can be suppressed with the optimization of the optical structure through proper color filter material and reduction...
5 mega CMOS image sensor with 1.9mum-pitch pixels has been implemented with 0.13 mum low power CMOS process. By applying 4-shared pixel architecture, 2.5V operation voltage, and tight design rules for some critical layers in pixels, high fill factor and the corresponding high saturation could be obtained. Image lag was sufficiently suppressed by pulse-boosting of transfer gate voltage and electrical...
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